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Identifying defects and measuring critical dimensions in semiconductor devices is challenging. Engineers and managers working in failure analysis and process improvement can now find hidden defects and perform exact measurements using 3D reconstruction.
3D reconstruction allows you to accurately visualize internal and surface elements, and measure critical dimensions (CDs). With 3D reconstruction, you can fine tune processes in real time to increase product reliability and yield. In this SPARK on-demand webinar, you will learn about:
Mark McClendon, Product Applications Specialist, Thermo Fisher Scientific
Mark McClendon has recently started the position of Americas NanoPort Product Application Specialist. Graduated from Northwestern University in May 2014 with a PhD in Chemical Engineering, Mark most recently was a postdoc at the University of Kentucky where he first gained experience with our Dual-Beam SEMs and Amira-Avizo. Visualization of biological samples using light and electron microscopy was the core of his academic career leading him to join Thermo Fisher’s application software team.