Webinar

As advanced packaging semiconductors, including 3D-IC, 2.5D, wafer level packaging, 2.5, and others, become more complex and three-dimensional, new performance and reliability challenges arise. These challenges include die-level defects, substrate imperfections, through-silicon via (TSV) formation problems, wafer thinning, bonding, and bump pitch issues.

Identifying these faults can be difficult and time-consuming. Manufacturers not only need to see inside the device but also require instruments that provide fast, precise, and accurate data and accelerate defect identification, improve processes, and reduce time to market.

In this SPARK on-demand webinar, you will discover:

  • Failure analysis, process metrology, and characterization challenges impacting advanced packaging devices
  • Industry-leading assembly failure isolation and analysis workflows, and complete die analysis workflows

 

Speakers:
Jake Jensen, Sr. Product Specialist, Thermo Fisher Scientific

Jake Jensen, Sr. Product Specialist, Thermo Fisher Scientific

Jake Jensen is a Senior Product Specialist in the semiconductor sales development group at Thermo Fisher Scientific, focusing on scanning electron and Thermo Scientific FIB/SEM DualBeam Instruments. He has over ten years of experience working with electron microscopes from his time as an Applications Engineer at Thermo Fisher Scientific in the Hillsboro, OR, NanoPort and his prior work as a research associate at the Center for Electron Microscopy and Analysis (CEMAS). Jake earned his bachelor’s degree in Ceramics and Materials Engineering from Clemson University and his Ph.D. in Materials Science and Engineering from The Ohio State University.

Jennifer Kopp, Sr. Product Marketing Manager, Thermo Fisher Scientific

Jennifer Kopp, Sr. Product Marketing Manager, Thermo Fisher Scientific

Jennifer Kopp has more than twenty years of experience in the semiconductor equipment industry, most recently in technical marketing leadership roles in electrical failure analysis and in-line inspection and metrology. She serves as Product Marketing Manager for Thermo Scientific Meridian Optical Fault Isolation (OFI) Systems and ELITE Lock-In Thermography (LIT) Systems. These systems are used to identify the location and root cause mechanisms of electrical failures in advanced IC devices and packages manufactured worldwide. Prior to joining Thermo Fisher Scientific, Jennifer worked in technical marketing and applications engineering roles at KLA-Tencor in Milpitas, CA, and Applied Materials in Santa Clara, CA. Jennifer has a BS in Chemical Engineering from Cornell University. Outside of work, she enjoys sailing the San Francisco Bay and neighboring waterways on her sailboat, the S.V. Sababa.

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