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Join us for another SPARK Thought Leader presentation. Or Haimson will share his current work at Annapurna Labs an Amazon company in partnership with Thermo Fisher Scientific on backside FIB circuit edit and advanced process nodes using a low energy focused ion beam. Learn how advances in failure analysis improves turnaround time, saving you time and money.
About Or Haimson
SPARK Thought Leader Or Haimson has over a decade of distinguished experience in the field of failure analysis. Before joining Annapurna Labs, he worked at Intel Fab 28 and Micron Technologies. Or earned his B.S. in Electrical Engineering and M.S. in Materials Engineering from Tel Aviv University.
About SPARK
Save time, save money, and stay on top of semiconductor technology advancement at SPARK, a knowledge platform from Thermo Fisher Scientific. SPARK is a collaborative space where industry thought leaders provide their perspective on tool performance and best practices.
SPARK establishes a community for professionals who want to easily access actionable semiconductor and microelectronics insights and gain visibility to state-of-the-art solutions, including the latest updates of Thermo Fisher Scientific’s semiconductor products and workflows.
Or Haimson is presently a Failure Analysis Engineer at Annapurna Labs, an Amazon Company. With over a decade of experience in IC design and Failure Analysis, Or has innovated very effectively to develop an exciting new “best practice” for circuit edit and rapid prototyping of modern devices. Prior to Annapurna Labs, Or worked in similar roles at Micron Technologies, Intel Fab 28 and Intel Israel Design Center (IDC) in Israel. Or received his Bachelor of Science in Electronic Engineering and is currently finishing his thesis towards Master of Science in Materials Engineering and Nano-technology, both from Tel Aviv University.
David Tien is presently the Product Marketing Director for the Circuit Edit product line. Prior to taking responsibility for the Circuit Edit product line, he managed the ELITE product line in the Electrical Failure Analysis (EFA) group working with FA engineers on silicon and package level fault isolation and failure analysis. His experience in the semiconductor industry spans over two decades with experience in not only electrical failure analysis but also in the areas of process development and process control and diagnostics. During this time, he has also authored over 15 technical publications and patents. David holds a bachelor’s degree in Chemical Engineering from UC Berkeley and an MBA from California State University.