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Semiconductor Engineering Advances Webinar Series
SPARK Webinar Series on semiconductor engineering, prototyping, and manufacturing advances
Testing new products for market, debugging designs, prototyping, increasing yield and optimizing process marginalities are daily challenges that semiconductor professionals confront. This SPARK webinar series gives you new insights into failure analysis and device innovations with dedicated tools. Learn how electrical failure analysis systems, (S)TEM solutions and dual-beam FIBs, and the latest logic and memory nanoprobing workflows make your profession life easier.
Register today to engage in our informative series of presentations tailored to the challenges your semiconductor business faces every day.
Semiconductor SPARK Webinar Series
Click the titles below to learn more about the semiconductor SPARK webinar series.
At emerging design nodes for both logic and memory devices, nanoprobing has become an essential part of the Failure Analysis lab workflows at every leading player. Thermo Fisher is bringing new products to market that deliver the highest levels of automation available to date. With platforms based on both electron beam and atomic force probing, the leader in serving science is again setting the pace with innovation and capability. Fast and highly accurate fault localization is critical to achieving the highest return on your (S)TEM investment. Watch our on-demand webinar and learn how the latest logic and memory nanoprobing workflows are critical to achieving the fastest possible yield ramp.
Speaker: John Miller Ph.D. - Senior Product Marketing Manager, Nanoprobing Product Line
John Miller, PhD serves as Sr. Marketing Manager for the nanoprobing product line. A marketing executive with both the capability and the passion to create products that solve technical and economic problems for customers, Dr. Miller joined Thermo Fisher Scientific with the acquisition of FEI in 2016. Prior to that, John held various roles of increasing responsibility through an 18-year tenure at KLA-Tencor; his knowledge of the semiconductor industry and its leading customers spans China, Korea, Taiwan, Japan, EMEA and the Americas. John holds both a BS and a PhD in Physics, the later from The University of Texas at Austin.
Today’s semiconductor and display roadmaps are being driven by the growing need for increased performance, lower cost, better power-efficiency, and shorter product development lifecycles. Device innovation is driving a shrink in device geometries, the incorporation of new materials and 3D structures. These, in turn, are driving a need for higher speed, more precise 3D physical failure analysis workflows. Techniques such as high-resolution SEM, (S)TEM imaging and EDS are becoming core elements of these 3D workflows. The Helios family of FIB/SEM DualBeam provides best-in-class sample preparation and in situ analysis capability. Watch our on-demand webinar to learn about the latest generation of DualBeam – the Helios 5 – and how it can help you meet your most challenging, site-specific (S)TEM sample preparation needs.
Speaker: Trevan Landin - Product Marketing Manager, Small DualBeam and SEM Product Lines
Trevan Landin is the Product Marketing Manager for Small Dual Beam and SEM Products targeted for Failure Analysis customers at Themo Fisher Scientific. Trevan has been in product marketing since 2017. Prior to joining the marketing team, Trevan spent 10 years in the NanoPort customer demo lab at Themo Fisher. In that role, Trevan worked with customers to determine which Dual Beam or SEM system suited their needs best and once installed, helping them achieve their objectives.
Prior to joining Thermo Fisher, Trevan spent 12 years as a FEOL process engineer in the semiconductor industry with a focus on epitaxial depositions on blanket and device wafers. Trevan holds a Bachelor of Science degree in Chemical Engineering from Washington State University.
Electrical Failure Analysis methods help the modern-day fab increase yield, debug design and process marginalities, and identify the root causes of quality and reliability failures. In this on-demand webinar, we introduce the Meridian S Optical Fault Isolation system and showcase several proven techniques used in the semiconductor industry today to localize, isolate and characterize the underlying root causes of device failure. Through careful control and modulation of electrical and optical device mechanisms and Design-for-Test (DFT) architectures, Meridian systems work to identify the specific location of a failure within a wafer, chip, or package. These locations are where you’ll find the killer defects that impact – or destroy – chip performance and reliability. Learn how Meridian S solves your most difficult failure analysis challenges at the low cost-of-ownership that optimizes device fabrication profitability.
Speaker: Jennifer Kopp - Product Marketing Manager, Optical Thermal Fault Isolation Product Line
Jennifer Kopp joined DCG Systems in 2015 and Thermo Fisher as part of the FEI acquisition in 2016. She presently serves as the Product Marketing Manager for the Meridian Optical Fault Isolation and ELITE Thermal Fault Isolation product lines. Jennifer has 20 years’ experience in the semiconductor equipment industry, including Technical Product Marketing and Applications Engineering roles in Electrical Failure Analysis, In-Line Inspection & Metrology, and Process Equipment segments. Jennifer holds a B.S degree in Chemical Engineering from Cornell University and lives in Oakland, California. Outside of work, Jennifer enjoys sailing her sailboat, S.V. Sababa, around the San Francisco Bay.
Are you tired of living with compromised Circuit Edit performance using an out-of-date tool or a “sometimes circuit edit” tool? Or, are you challenged by device topography causing non-planar delayering when accessing deep layers in the device? Are you suffering from poor acuity and non-uniform deep vias and inadequate conductor filling? If you want a simpler more efficient and effective “rapid prototyping” solution for advanced edits, don’t compromise any longer. The new Thermo Scientific Centrios is a dedicated Circuit Edit system offering a simple and easy-to-use interface for advanced circuit edits, incorporating the latest improvements in Focused Ion Beam (FIB), Secondary Electron Detection (SED), and Gas Delivery technology that you come to expect from Thermo Scientific EFA / PFA lab instruments. Watch our on-demand webinar to learn how Centrios can help you save months in manufacturing cycle time through rapid prototyping and design debug / repair so that you bring new products to market faster.
Speakers:
David Tien - Product Marketing Director, Circuit Edit Product Line
David Tien is presently the Product Marketing Director for the Circuit Edit product line. Prior to taking responsibility for the Circuit Edit product line, he managed the ELITE product line in the Electrical Failure Analysis (EFA) group working with FA engineers on silicon and package level fault isolation and failure analysis. His experience in the semiconductor industry spans over two decades with experience in not only electrical failure analysis but also in the areas of process development and process control and diagnostics. During this time, he has also authored over 15 technical publications and patents.
David holds a bachelor’s degree in Chemical Engineering from UC Berkeley and an MBA from California State University.
Michael Wong – Senior Field Applications Engineer, Circuit Edit Product Line
Michael Wong is the Lead Application Engineer for the Circuit Edit product line in the Electrical Failure Analysis group. He specializes in application and workflow development for advanced process nodes and packaging, and novel techniques for Focused Ion Beam technologies. Prior to joining Thermo Fisher Scientific, Michael was a Research and Development Engineer with expertise in tool development for the Physical Debug Lab at Intel Corp. He is also experienced in current microfabrication techniques and device physics. Michael holds a Master’s degree in Electrical Engineering from the University of California at Davis with an emphasis in Cold Beam Ion source technology.
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