Helios 5 EXL DualBeam

Demand for high-performance, energy-efficient electronics is driving the development of advanced devices with ever smaller, more densely packed features and complex 3D structures. Ramping production of these cutting-edge microprocessors, memory devices, and other products is extremely challenging and requires high-resolution, atomic-scale analysis of features buried deep within the device. Transmission electron microscopy (TEM) is increasingly becoming the go-to technique for this kind of analysis and relies on high-quality samples produced with focused ion beam (FIB) milling.

The Thermo Scientific Helios 5 EXL DualBeam is a 300mm full-wafer focused ion beam scanning electron microscope (FIB-SEM), designed to address TEM sample preparation challenges in the semiconductor industry. The Helios 5 EXL DualBeam is capable of preparing samples for today’s most advanced process nodes, including sub-5nm and gate-all-around technology.

Maximizing sample throughput and productivity

Utilizing advanced machine learning and closed-loop end pointing, the Helios 5 EXL DualBeam delivers enhanced cut placement precision and enables you to consistently extract high-quality lamella from your most challenging samples.

Flexible automation capabilities make ultra-thin TEM sample generation routine and consistent, providing unparalleled, sub-nanometer insight into more interfaces, films, and profiles to measure at sub-nanometer resolution. The Helios 5 EXL DualBeam ensures efficient and consistent TEM sample preparation workflows by combining wafer and defect navigation with recipe definition and execution in a single, fully integrated program. This automation supports a higher tool-to-operator ratio, maximizing sample throughput and technical resource productivity.

Revolutionizing Semiconductor Analysis: Thermo Scientific Helios 5 EXL Overview

Automated TEM sample preparation software

Thermo Scientific AutoTEM 5 Software combines wafer and defect navigation with recipe definition and execution in a single, fully integrated program, ensuring efficiency and consistency among operators with varying levels of expertise. AutoTEM Software simplifies TEM sample preparation, allowing users to easily schedule multi-site jobs for inverted, plan-view, and top-down TEM sample preparation workflows.

Repeatable, automated deposition and etch

Developed specifically to support automated TEM preparation, the Thermo Scientific MultiChem Gas Delivery System provides highly consistent deposition and etching capabilities and can be utilized with automated applications. The motorized injection needle with saved position presets can be accurately positioned for optimized, reproducible gas delivery to the sample surface. The MultiChem Gas Delivery System is also engineered for serviceability, maximizing tool uptime.

Precision FIB milling for advanced sample preparation

The Helios 5 EXL DualBeam includes the Thermo Scientific Phoenix Ion Column, which provides revolutionary low-kV performance and leading-edge TEM sample preparation.

Automated alignments, high resolution, and consistent results

The high-performance Thermo Scientific Elstar Electron Column features our unique UC monochromatic technology, offering improved resolution and TEM sample end-pointing. New SEM auto-alignments ensure consistent results across multiple tools and operators.

Automated sample manipulation and lift out

With an intuitive method for lift-out and transfer of TEM samples to a grid, the Thermo Scientific EasyLift Nanomanipulator offers low-drift, high-precision movements for simple and consistent creation of traditional or ultra-thin TEM lamella. Highly accurate, easy-to-use, and fast motorized rotation makes the EasyLift Nanomanipulator ideally suited for high-speed inverted or plan-view sample preparation.

Fab-compatible Automated FOUP Loader (AFL) option

The optional Automated FOUP Loader (AFL) enables the Helios 5 EXL DualBeam to be located inside the semiconductor wafer fab. By being closer to the wafer process line (near-line), it can deliver critical information up to three times faster than laboratory-based analysis of cleaved wafer pieces, accelerating the development of new processes and the yield ramp to high-volume production.