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Semiconductor Analysis
Semiconductor Metrology and Yield Analysis
Semiconductor metrology and yield analysis workflows for high-speed, high-resolution, 3D characterization, providing the fastest time to yield.
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As semiconductor device design approaches smaller nodes, it becomes more and more difficult to ramp manufacturing yields. These smaller nodes, as well as more complex 3D architectures, result in added steps and more complexity in the design process. Hundreds of steps are involved, and any defect or electrical fault that occurs in any one step will slow down the total production time. Since time-to-market and time-to-yield are both crucial for the commercial success of any new semiconductor design, metrology and inspection tools are needed to make sure each of these steps is optimized. This ensures the maximum yield can be guaranteed and maintained.
Yield analysis must be carried out as quickly and as inexpensively as possible. However, given the many steps involved in device manufacture, this can often be an extremely challenging proposition. For example, in an advanced logic device, many different measurements need to be taken, such as the finFET gate height, fin height, and sidewall angle. Performing these measurements in a cost-effective and timely manner requires advanced characterization tools designed specifically for semiconductor analysis. By using automated SEM or (S)TEM based metrology instruments, manufacturers can provide accurate and timely semiconductor inspection, lower manufacturing costs, and shorten the product development cycle.
Thermo Fisher Scientific offers a suite of next-generation products with advanced analytical capabilities for semiconductor metrology and inspection. These solutions are designed to help increase productivity in semiconductor fabrication labs by improving quality control and yield in the manufacture of logic, 3D NAND, DRAM, analog, power and display devices.
Semiconductor metrology & yield ramp workflow examples
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Thermal Fault Isolation
Uneven distribution of local power dissipation can cause large, localized increases in temperature, leading to device failure. We offer unique solutions for thermal fault isolation with high-sensitivity lock-in infrared thermography (LIT).
TEM Metrology
Advanced and automated TEM metrology routines deliver significantly greater precision than manual methods. This allows users to generate large amounts of statistically relevant data, with sub-angstrom-level specificity, that is free of operator bias.
Sample Preparation of Semiconductor Devices
Thermo Scientific DualBeam systems provide accurate TEM sample preparation for atomic-scale analysis of semiconductor devices. Automation and advanced machine learning technologies produce high-quality samples, at the correct location, and a low cost per sample.
SEM Metrology
Scanning electron microscopy provides accurate and reliable metrology data at nanometer scales. Automated ultra-high-resolution SEM metrology enables faster time-to-yield and time-to-market for memory, logic, and data storage applications.
Semiconductor Analysis and Imaging
Thermo Fisher Scientific offers scanning electron microscopes for every function of a semiconductor lab, from general imaging tasks to advanced failure analysis techniques requiring precise voltage-contrast measurements.
Device Delayering
Shrinking feature size, along with advanced design and architecture, results in increasingly challenging failure analysis for semiconductors. Damage-free delayering of devices is a critical technique for the detection of buried electrical faults and failures.
Thermal Fault Isolation
Uneven distribution of local power dissipation can cause large, localized increases in temperature, leading to device failure. We offer unique solutions for thermal fault isolation with high-sensitivity lock-in infrared thermography (LIT).
TEM Metrology
Advanced and automated TEM metrology routines deliver significantly greater precision than manual methods. This allows users to generate large amounts of statistically relevant data, with sub-angstrom-level specificity, that is free of operator bias.
Sample Preparation of Semiconductor Devices
Thermo Scientific DualBeam systems provide accurate TEM sample preparation for atomic-scale analysis of semiconductor devices. Automation and advanced machine learning technologies produce high-quality samples, at the correct location, and a low cost per sample.
SEM Metrology
Scanning electron microscopy provides accurate and reliable metrology data at nanometer scales. Automated ultra-high-resolution SEM metrology enables faster time-to-yield and time-to-market for memory, logic, and data storage applications.
Semiconductor Analysis and Imaging
Thermo Fisher Scientific offers scanning electron microscopes for every function of a semiconductor lab, from general imaging tasks to advanced failure analysis techniques requiring precise voltage-contrast measurements.
Device Delayering
Shrinking feature size, along with advanced design and architecture, results in increasingly challenging failure analysis for semiconductors. Damage-free delayering of devices is a critical technique for the detection of buried electrical faults and failures.
Semiconductor Materials and Device Characterization
As semiconductor devices shrink and become more complex, new designs and structures are needed. High-productivity 3D analysis workflows can shorten device development time, maximize yield, and ensure that devices meet the future needs of the industry.
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Electron microscopy services for
semiconductors
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