Webinar

Duration: 40 minutes

Advanced packaging: wafer level defect analysis and metrology

Heterogeneous integration of several chips in one package has strong interest as a way to continue semiconductor performance scaling.

However, enabling the performance gains in advanced packaging semiconductors also comes with new challenges in metrology and failure analysis. Defect analysis and metrology require the ability to identify and measure features buried within the device.

Thermo Fisher Scientific provides industry leading wafer-level and die-level solutions such as the Thermo Scientific Helios 5 PXL Wafer DualBeam, a plasma focused ion beam scanning electron microscope (PFIB SEM) to address advanced packaging challenges and support analysis needs.

In this webinar, we explore its unique value and capabilities of process metrology and defect analysis to address wafer-level packaging challenges.

This webinar provides:

  • An overview of advanced packaging challenges
  • An overview of Thermo Fisher process metrology and failure analysis solutions for advanced packaging
  • Information on the unique challenges for through-silicon vias (TSV) process metrology and defect analysis workflows
  • An introduction of the Helios 5 PXL and its unique capabilities for the advanced packaging market
About the speaker:
Ivy Wu

Ivy Wu

Ivy Wu is a Product Marketing Manager with 7 years of experience working in the semiconductor equipment industry. Prior to her current role, Ivy was a senior process engineer in a metrology lab and semiconductor fab. Ivy earned her PhD degree in applied physics at the University of Massachusetts Lowell.

 

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