Automated Semiconductor Sample Preparation Webinar

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Manual sampling can introduce errors. Instrument misalignments can impact cut placement accuracy. Producing ultra-thin samples on sub 3 nm nodes can be a highly complicated process. All of this can add up to slower sample turnaround and lost productivity. 

Thermo Fisher Scientific’s newest full-wafer DualBeam system uses machine learning and automation to produce wafer-based TEM samples with unprecedented placement control —accelerating time-to-data and improving time-to-yield for the latest generation of advanced logic devices. 

What you will learn in this webinar

• How machine learning for end-pointing helps control final cut thickness and location—supporting the highest-precision cut placements required for 5 nm and GAA process nodes.
• How improved automation helps scale operations and optimize technical resources.
• How enhanced ease-of-use increases sample throughput, analysis confidence, and productivity.

Who should attend this webinar

This webinar is for failure analysis managers, technicians evaluating process maturity, and anyone who needs fast, accurate wafer-based sample prep for TEM imaging.

About the Semiconductor SPARK Webinar Series

SPARK is a knowledge community where semiconductor professionals, researchers, and thought leaders can provide their perspective on tool performance and best practices, access semiconductor and microelectronics insights, and gain visibility into state-of-the-art solutions.

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