The Thermo Scientific Celestron transmission line pulse/very fast transmission line pulse (TLP/VF-TLP) Test System can be configured for both Standard TLP and VF-TLP for testing at the wafer and/or package level. Optional probes can be used to measure signals on pins or pads other than the ones being stressed. The Celestron system software is the most comprehensive in the industry and utilizes graphics to assist in system setup and connection to the device under test (DUT). During test operations, it displays the recorded TLP pulse voltage and current waveforms, compiled pulsed I-V curve, leakage current measurements, and DC I-V curve trace data. The operator can select the range of test voltages (stress pulses), pulse polarity, leakage and curve trace parameters. The position and duration of the measurement window within the TLP pulse can also be selected, and modified after the data is collected.

Key Features

Flexible test capabilities

The Thermo Scientific Celestron TLP/VF-TLP Test System can be configured for Standard TLP and VF-TLP for testing at the wafer level and/or package level. Optional probes can also be used to measure signals on pins or pads other than the ones being stressed. 

Unsurpassed test control

The operator can select the range of test voltages (stress pulses), pulse polarity, leakage and curve trace parameters. The position and duration of the measurement window within the TLP pulse can also be selected, and modified after the data is collected.

Pulse generator

High current TLP pulse generator.

Probers

Can be interfaced with semiautomatic probers.


Specifications

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Standard TLP configurationPulse widths from 30 to 500ns

Integrated in the pulser box, the standard TLP Pulse width is 100ns

Additional pulse widths can be added externally through a cable change ranging from 30 to 500ns

Optional computer controlled pulse width with 3 selectable pulse widths

Rise times available

Standard rise time is 200ps

Optional rise times from 500ps to 10ns

Controlled by optional external rise time filters

2ns and 10ns external rise time filter included

Optional computer controlled rise time with 3 selectable rise times

Note: 500 MHz or faster oscilloscope is required for TLP measurements

1 GHz or grater scope is recommended for measurements with rise times of less than 1ns

Support of all TLP configurations

Optional changing of configuration for 25 to 500 ohm delivery impedances

Support for all configurations described in the ESD Association’s TLP Standard Test Method

Both wafer level and package testing at all impedances

Standard TLP / VF-TLP configurationIntegrated system controller

No need for a dedicated computer

Windows® operating system

Integrated source/meter unit

Curve Tracing to ± 200V

Leakage measurements down to 50pA

DUT failure detection based on leakage or voltage with forced current or both

Transmission Line Pulse
(TLP / VF-TLP)

Designed in compliance with the current ESD Association Standard Test Method Documents (ANSI/ESD STM 5.5.1-2016)

Standard VF-TLP configurationPulse widths from 1.2 to 10ns

Selected by cable change at front of system

Standard widths are 1.2, 2.5 and 5ns (others optional)

Rise times from 200ps to 2ns

Controlled by optional filters

Standard rise times are 200 and 300ps

2ns external rise time fi ler included

Maximum pulse current

15A into a 50 ohm load

Approximately 30A into a short circuit

Maximum open circuit voltage

1500V

Applications

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ESD Semiconductor Qualification

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ESD Compliance Testing

Electrostatic discharge (ESD) can damage small features and structures in semiconductors and integrated circuits. We offer a comprehensive suite of test equipment which verifies that your devices meet targeted ESD compliance standards.

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ESD Compliance Testing

Electrostatic discharge (ESD) can damage small features and structures in semiconductors and integrated circuits. We offer a comprehensive suite of test equipment which verifies that your devices meet targeted ESD compliance standards.

Learn more ›

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