High-sensitivity analysis for semiconductor materials and manufacturing

Vibrational spectroscopy techniques (including mid- and far-infrared, near-infrared, and Raman) provide powerful options for analyzing and optimizing semiconductor materials and manufacturing processes.  From incoming raw materials through fabrication and QA/QC, these techniques can provide detailed information about the chemical composition, molecular structure, and crystal orientation of the materials. Consequently, they help ensure production of high-quality and reliable semiconductor components for use in computers, smartphones, TVs and displays, medical devices and more.

In this infographic, you’ll learn about the solutions available for semiconductor manufacturing process and metrology tool manufacturers.

Download Infographic: Analytical solutions for semiconductor manufacturing processes

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Applications and analytical solutions for semiconductor manufacturing


Metrology tool manufacturers

Vibrational spectroscopy is an essential technique for semiconductor metrology tool manufacturers who produce equipment used for measuring and characterizing properties in materials and devices at the nanoscale for the semiconductor industry. It provides customers with the high precision and sensitivity they need to ensure the metrology tools produced perform as expected.


ApplicationSolution
Wafer analysis for R&D – Ellipsometry to analyze film deposition and dopant concentration parameters

Wafer Mapping + Nicolet Apex FTIR Spectrometer or Nicolet iS50 FTIR Spectrometer

Process and instrument development

Nicolet iG50 FTIR Spectrometer
Robotic wafer handling and testing instrument manufacture (EPI, C, O, BPSG)

Nicolet iG50 FTIR Spectrometer OEM configuration


Device fabrication: Chemical supply

During this stage, chemicals are delivered to the manufacturing plant to be used in the production of semiconductor devices. This is a critical stage for the workflow, as it is essential that the high-quality etching, cleaning and other processing fluids delivered that meet the stringent purity and quality requirements for semiconductor fabrication.

ApplicationSolution
Ultra pure gas suppliersAPIX/APIMS Quattro Ultra High Purity (UHP) Electronic Gas Analyzer

MAX-iR FTIR Gas Analyzer

Antaris IGS Gas Analyzer

Specialty chemical supplier quality assurance and quality control (QA/QC)

Antaris II FT-NIR Analyzer
Antaris MX FT-NIR Process Analyzer

Device fabrication: Semiconductor chip production

The chip production stage is where the actual manufacturing of the semiconductor devices takes place. It involves a series of complex and highly controlled processes that transform the raw materials into finished semiconductor chips.

ApplicationSolution
Deposition impurities and crystallinity determination

DXR3 Flex Raman Spectrometer
DXR3 Raman Microscope

Chemical bath fluid monitoring

Antaris MX FT-NIR Process Analyzer

High concentration etching and doping gases

Antaris IGS FTIR Spectrometer
Nicolet Apex FTIR Spectrometer

Ultra pure gas quality assurance (QA)

MAX-iR FTIR Gas Analyzer


Device fabrication: Emissions monitoring

The emissions generated during the semiconductor device fabrication process are monitored and controlled to ensure that they meet regulatory requirements and do not pose a risk to human health or the environment. There are a variety of emissions generated during this stage, such as volatile organic compounds (VOCs), hazardous gases, and particulate matter.

ApplicationSolution

Continuous emissions and environmental monitoring

MAX-iR FTIR Gas Analyzer
Antaris IGS FTIR Gas Analyzer

Final testing

The semiconductor device fabrication final testing stage is where the devices are thoroughly tested to ensure they meet the required specifications and quality standards. This is another critical stage to ensure the devices are reliable and perform as expected in their intended final products.

ApplicationSolution

Quality assurance and quality control (QA/QC) including final testing and inspection, or failure analysis

Nicolet iN10 Infrared Microscope


Assembly and packaging

During this stage the semiconductor devices are assembled into packages that protect them and make them ready for use. It’s important to characterize the chemical and physical properties of the materials used in the packaging and in the encapsulation process to ensure the devices are protected from environmental factors and mechanical stresses.

ApplicationSolution

Defect analysis

DXR3 Raman Microscope
Nicolet iN10 Infrared Microscope
Check incoming materials (polymer, epoxy, etc.)Nicolet Apex FTIR Spectrometer
Nicolet iS50 FTIR Spectrometer

Vibrational spectroscopy semiconductor application notes and resources



Raman spectroscopy for semiconductor analysis


The advancements in renewable energy technology such as solar and wind, and subsequent need for high-capacity batteries for energy storage, have significantly increased the demand of semiconductor materials. This has led to increased research on existing semiconductor materials and on exploring newer materials in search of better performance and lower cost. Examples of these materials include photovoltaic materials, including Si-based, CIGS (copper indium gallium selenide), CdTe, organics, and III-Vs.

 

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