Solving advanced logic device failure analysis challenges

Failure analysis (FA) labs are facing entirely new challenges due to the reduction in feature size, transistor (3D) complexity, and the adoption of backside metal layers for power distribution.

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Failure analysis (FA) labs are facing entirely new challenges due to the reduction in feature size, transistor (3D) complexity, and the adoption of backside metal layers for power distribution.

These challenges have not only increased the number of failures that need to be analyzed, they are also necessitating the adoption of new FA processes:

E-beam probing to achieve greater localization accuracy and penetration through metal interconnects
Nanoprobing workflow application evolution for better transistor characterization data
AI automation and low-kV FIB performance to make the TEM sample preparation process more productive and repeatable

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