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Semiconductor metrology, defect, and failure analysis of advanced logic devices
Navigating the blend of 2D scaling and 3D complexity in advanced logic devices presents unparalleled challenges for current metrology, defect analysis, and failure analysis solutions. Thermo Fisher Scientific addresses these challenges through innovation, offering efficient workflow solutions to assist you in overcoming these obstacles.
TEM metrology and defect analysis
Wafer-level FIB SEM DualBeam instruments enable fast TEM sample preparation without compromising wafer integrity, allowing for faster time to actionable data. TEM workflows used during the front-end-of-line (FEOL) process offer comprehensive metrology data and facilitate early defect analysis, empowering process and yield engineers to ramp up yield more quickly.
The Metrios 6 (S)TEM provides automated TEM imaging and metrology on gate-all-around structures
Semiconductor failure analysis
Semiconductor failure analysis experts utilize advanced tools and workflows to investigate failed components, determine failure mechanisms, and provide insights for improving design and manufacturing processes.
The Thermo Scientific Meridian EX System highlights gates operating at a specific frequency
For Research Use Only. Not for use in diagnostic procedures.