Semiconductor Metrology and Failure Analysis Tools

Semiconductor metrology, defect and failure analysis tools

At Thermo Fisher Scientific, we understand the importance of precise measurements, defect identification, and failure analysis in ensuring the success and reliability of these advanced technologies, including gate-all-around. With our expertise and advanced tools, we offer tailored solutions for the unique challenges faced by advanced semiconductor manufacturers. Whether you need to optimize manufacturing processes or overcome technical issues, our team is here to support you. Explore our optimized solutions and let us help drive innovation excellence in your manufacturing endeavors.

Semiconductor metrology tools

For metrology applications, we provide product solutions from TEM sample preparation to TEM imaging and analysis and TEM metrology. Learn more about our metrology workflow solutions for advanced logic transistor manufacturing.

Helios 5 EXL Wafer DualBeam

The Thermo Scientific Helios 5 EXL DualBeam is a 300 mm full-wafer FIB-SEM designed to address TEM sample preparation challenges in the semiconductor industry. The Helios 5 EXL DualBeam can prepare samples for today’s advanced process nodes, including sub-5 nm and gate-all-around technology.

Metrios 6 (S)TEM

The Thermo Scientific Metrios 6 Scanning Transmission Electron Microscope is a new-generation, fully automated metrology solution with enhanced productivity and data quality for high-volume TEM metrology. Featuring newly designed hardware and machine-learning-based capabilities, the Metrios 6 (S)TEM offers a 20% productivity improvement on average compared to previous-generation solutions.

Metrios AX TEM

The Thermo Scientific Metrios AX Scanning Transmission Electron Microscope is a 60–200 kV scanning transmission electron microscope, designed from the ground up to deliver repeatable imaging, analytics, and gauge-capable metrology results at an advanced throughput level.

Semiconductor defect analysis tools

We provide product solutions to solve advanced logic defect analysis challenges from TEM sample preparation, delayering, and TEM imaging and analysis. Learn more about our defect analysis workflows and discover our unique advantages on surface/near-surface defect analysis, buried physical defect analysis, and electrical defect analysis.

Helios 5 EXL Wafer DualBeam

The Thermo Scientific Helios 5 EXL DualBeam is a 300 mm full-wafer FIB-SEM designed to address TEM sample preparation challenges in the semiconductor industry. The Helios 5 EXL DualBeam can prepare samples for today’s advanced process nodes, including sub-5 nm and gate-all-around technology.

Helios 5 PXL PFIB Wafer DualBeam

The Thermo Scientific Helios 5 PXL Wafer DualBeam is a plasma focused ion beam scanning electron microscope (PFIB-SEM) that features high-performance, in-line metrology, wafer-level delayering, and process monitoring to quickly provide critical insights for process development and manufacturing engineers.

Talos F200E TEM

The Thermo Scientific Talos F200E Scanning Transmission Electron Microscope combines outstanding high-resolution scanning transmission electron microscope and transmission electron microscope imaging with exceptional energy dispersive X-ray spectroscopy (EDS) signal detection and 3D characterization with compositional mapping.

Spectra Ultra (S)TEM

The Thermo Scientific Spectra Ultra Scanning Transmission Electron Microscope introduces advanced capabilities designed to overcome structural and material challenges, setting a new standard in advanced TEM analysis. Flexible, high-tension switching lets you quickly switch voltages for your specific needs. In addition, the high-performance Thermo Scientific Ultra-X Detector shortens elemental mapping time and makes it possible to analyze beam-sensitive structures.

Semiconductor failure analysis tools

We have extensive expertise in delivering exceptional failure analysis solutions for advanced logic transistor manufacturing, including fault localization, sample preparation, and imaging and analysis. Learn more about our failure analysis workflows and discover our unique solutions for electrical failure analysis and physical failure analysis on advanced logic devices and gate-all-around backside power delivery.

Elite System

Using high resolution lock-in thermography (LIT) with high sensitivity, the Thermo Scientific ELITE System provides a critical solution for through package, on-die or even on-board electrical defect localization for the widest range of defect types, including power or line shorts, ESD defects, current leakage, oxide damage, defective transistors and diodes, device latch-up and resistive opens.

Meridian IV System

The Thermo Scientific Meridian IV System utilizes photon emission microscopy for isolating FEOL issues, and laser scanning microscopy for static and dynamic failure analysis. These applications isolate critical timing and electrical failures.

Meridian EX Fault Isolation System

The Thermo Scientific Meridian EX System is an innovative electron-beam-based solution for precise defect localization in advanced logic devices. Using groundbreaking e-beam technology, it allows probing through complex wiring networks from the frontside or backside of the device. Providing a 10× resolution boost over optical methods, this helps to ensure rapid, accurate, and reliable defect analysis of the advanced semiconductor devices.

nProber IV System

The Thermo Scientific nProber IV System is a high-performance SEM-based platform for the localization of transistor and metallization faults. It is an industry trusted nanoprobing system utilizing the high-resolution LEEN2 SEM Column specifically designed to increase speed, accuracy, and output at a critical path in FA workflows, where productivity is paramount.

Hyperion II System

The Thermo Scientific Hyperion II System is an atomic force prober (AFP) based nanoprobing platform that employs multiple scanning probe tips to image and electrically contact the device under test for fault localization and electrical characterization in support of semiconductor technology development, yield engineering and device reliability improvement.

Helios 5 PFIB DualBeam

The Thermo Scientific Helios 5 Plasma FIB (PFIB) DualBeam delivers high-throughput, planar/uniform large area delayering, sample preparation, and large-area physical failure analysis for advanced logic and packaged devices.

Helios 6 HD FIB-SEM

The Thermo Scientific Helios 6 HD Focused Ion Beam Scanning Electron Microscope (FIB-SEM) is designed to meet the industry need for higher volumes of high-quality TEM data for failure analysis and metrology. This addition to the Thermo Scientific family of industry-standard DualBeam instruments delivers increased sample quality and productivity, which, in turn, deliver better TEM data. Producing higher quality TEM data provides actionable information to maximize manufacturing yields and end-product quality.

Talos F200E TEM

The Thermo Scientific Talos F200E Scanning Transmission Electron Microscope combines outstanding high-resolution scanning transmission electron microscope and transmission electron microscope imaging with exceptional energy dispersive X-ray spectroscopy (EDS) signal detection and 3D characterization with compositional mapping.

Spectra Ultra (S)TEM

The Thermo Scientific Spectra Ultra Scanning Transmission Electron Microscope introduces cutting-edge capabilities designed to overcome structural and material challenges, setting a new standard in advanced TEM analysis. Flexible high-tension switching lets you quickly switch voltages for your specific needs. In addition, the high-performance Thermo Scientific Ultra-X Detector shortens elemental mapping time and makes it possible to analyze beam-sensitive structures.

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