Nanoscale Materials Characterization Resources

“We chose to go with a Thermo Scientific DualBeam FIB-SEM and TEM as it’s a sensational package and we considered these instruments to be the best systems for our needs.”

—    Dr. Geoff West, University of Warwick Advanced Manufacturing & Materials Centre

“Thermo Fisher Scientific’s advanced S/TEMs are incredibly powerful, such that the limiting factor is not the microscope, but the sample quality. Fortunately, we are able (with superb control) to create excellent quality site-specific specimens with our Helios FIB-SEM.”

—  Professor Bart J. Kooi, University of Groningen Nanostructured Materials and Interfaces Research Group

“Using FIB and TEM from the same vendor offers advantages for equipment users and facility managers. Users will more easily transfer samples from different equipment and techniques if needed. The similar operating system and data format will also minimize users’ learning time. Facility managers will also more easily receive service and support.”

—  Dr. Yufeng Zheng, University of Nevada, Reno, Department of Chemical and Materials Engineering

“The Talos F200X TEM is one of the most sophisticated S/TEM systems and it has contributed to our business since it was introduced in 2016. The highly sensitive EDX system, Super-X Detector, and traditionally established tomography system have opened up a new territory in materials science. Furthermore, the high stability of its optic system has enabled automated continuous data acquisition at a large scale, and it is indispensable for monozukuri in the materials informatics era.”

—    Dr. Takuji Ube, JFE Techno-Research Corporation Nanoscale Characterization Center

“Acquiring detailed information on the interface structures of MOF and COF is extremely difficult due to challenging sample preparation and extreme beam-sensitivity of the materials. By combining Thermo Scientific cryogenic focused ion beam (cryo-FIB) technology for specimen preparation and integrated differential phase contrast STEM (iDPC-STEM) for imaging, plug-socket like connections between MOF and COF components were captured successfully in the interface region.”

—    Professor Daliang Zhang, Chongqing University