Transmission electron microscopy

Transmission electron microscopy (TEM) is a high-resolution imaging technique in which a beam of electrons passes through a thin sample to produce an image. The electron beam is impacted by the sample’s thickness/density, composition and, in some cases, crystallinity. The electrons that are transmitted through the specimen subsequently provide contrast in the resulting image.

TEM is capable of unparalleled resolution due to the small wavelength of the transmitted electrons. Unlike scanning electron microscopy (SEM), which gathers the net intensity of secondary electrons in each point of the scan, TEM resolution is only limited by the wavelength of the individual electron and the quality of the electron optics. This means that transmission electron microscopes can routinely collect sub-nanometer scale (if not atomic-resolution) images.

Scanning transmission electron microscopy

Scanning transmission electron microscopy (STEM) combines the principles of transmission electron microscopy (TEM) and scanning electron microscopy (SEM). Like TEM, STEM requires very thin samples and looks primarily at beam electrons transmitted by the sample. One of STEM’s principal advantages over TEM is that it enables the use of other signals that cannot be spatially correlated in TEM, including characteristic X-rays and electron energy loss spectra (EELS).

Like SEM, STEM scans a very finely focused beam of electrons across the sample in a raster pattern. Interactions between the beam electrons and sample atoms allows for simultaneous acquisition of multi-modal data, which is correlated with beam position to build a virtual image in which the signal level at any location in the sample is represented by the contrast of the image. Its primary advantage over conventional SEM imaging is the improvement in spatial resolution.

With STEM, extremely localized analytical data can be collected for your sample. This includes large-area, high-resolution energy-dispersive X-ray spectroscopy (EDS) maps, probing of oxidation states using EELS, and atomic-resolution imaging of material interfaces.

Cryo-transmission electron microscopes

Cryo-electron microscopy (cryo-EM) describes an increasingly popular group of life sciences techniques including single particle analysis, micro-electron diffraction, and cryo-tomography. Cryo-EM is performed on cryo-transmission electron microscopes (cryo-TEMs), which are specialized TEMs designed to operate at cryogenic temperatures. They typically feature modifications to sample loading, the sample chamber, and the sample stage to maintain the required temperatures and to reduce sample contamination and damage.

Learn more about cryo-electron microscopy ›

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Transmission electron microscopes

Thermo Scientific TEMs feature enhanced imaging and analysis through simplified/automated operation, offering higher data quality and faster acquisition times. They also combine outstanding high-resolution STEM imaging with unparalleled advances in EDS signal detection for compositional mapping and 3D chemical characterization with the Thermo Scientific Dual-X, Super-X, and Ultra-X EDS Detectors. Thermo Scientific TEM platforms are suited for multi-user and multi-discipline environments, combining multiple applications in a single system.

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Life Sciences

 

Materials Science

 

Semiconductors


Techniques

Life Sciences

 

Materials Science

 

Semiconductors


Apreo ChemiSEM System

  • Integrated SEM imaging and chemical characterization
  • Enhanced automation to simplify workflows
  • Extended source lifetime and schedulable upgrades

Helios 6 HD FIB-SEM

  • High-volume TEM sample prep
  • Maximized system utilization
  • Failure analysis and metrology

Meridian EX System

  • Novel electron beam probing
  • 10x resolution versus optical
  • <5 nm node defect localization

Hydra Bio Plasma-FIB

  • Volume EM for cryo or resin-embedded samples with 4 switchable ion species
  • Millimeter-scale slicing with high z-precision with Spin Mill Bio Method
  • Integrated light microscope for correlative targeting

Iliad (S)TEM

  • Advanced integration of EELS and SEM optics
  • Electrostatic beam blanker
  • High energy resolution electron source

Krios G4 Cryo-TEM

  • Improved ergonomics
  • Fits more easily into new and existing labs
  • Maximized productivity and automation
  • Best image quality for high-resolution 3D reconstruction

Glacios 2 Cryo-TEM

  • High-resolution structure determination tool (<3Å)
  • Unparalleled ease-of-use through AI-enhanced automation
  • Flexible modes of operation standard: SPA, tomography, MicroED

Tundra Cryo-TEM

  • Structural information at biologically relevant resolution
  • Space efficient and cost effective
  • Easy, iterative sample optimization
  • Unique AI algorithms for streamlined data collection

Spectra Ultra TEM

  • New imaging and spectroscopy capabilities on the most beam sensitive materials
  • A leap forward in EDX detection with Ultra-X
  • Column designed to maintain sample integrity

Spectra 300 TEM

  • Highest-resolution structural and chemical information at the atomic level
  • Flexible high-tension range from 30-300 kV
  • Three lens condenser system

Spectra 200 TEM

  • High-resolution and contrast imaging for accelerating voltages from 30-200 kV
  • Symmetric S-TWIN/X-TWIN objective lens with wide-gap pole piece design of 5.4 mm
  • Sub-Angstrom STEM imaging resolution from 60 kV-200 kV

Talos F200S TEM

  • Intuitive and easy-to-use automation software
  • Available with Super-X EDS for rapid quantitative chemical analysis
  • High-throughput with simultaneous multi-signal acquisition

Talos F200i TEM

  • Compact design with X-TWIN objective lens
  • Available with S-FEG, X-FEG, and X-CFEG
  • Flexible and fast EDS options for comprehensive elemental analysis

Talos F200X TEM

  • High-resolution, EDS cleanliness, and quality in 2D as well as 3D
  • X-FEG and X-CFEG available for the highest brightness and energy resolution
  • High accuracy and repeatable results with integrated Thermo Scientific Velox Software

Talos F200C TEM

  • High-contrast and high-quality TEM and STEM imaging
  • 4k x 4k Ceta CMOS camera options for large FOV and high read-out speeds
  • Large pole piece gap and multiple in situ options

Talos L120C TEM

  • High versatility and stability
  • 4k x 4k Ceta CMOS camera for speed and large FOV
  • TEM magnification range of 25X to 650kX
  • EDS and STEM options for compositional analyses

Metrios AX TEM

  • Automation options to support quality, consistency, metrology, and reduced OPEX
  • Leverages machine learning for superior autofunctions and feature recognition
  • Workflows for both in-situ and ex-situ lamella preparation

Metrios 6 (S)TEM

  • Fully Automating Semiconductor Metrology Workflows
  • Recipe-Free Automation for (S)TEM Metrology
  • Efficient Chemical Analysis

ExSolve WTP DualBeam

  • Can prepare site-specific, 20 nm thick lamellae on whole wafers up to 300 mm in diameter
  • Addresses needs requiring automated, high-throughput sampling at advanced technology nodes

Helios 5 EXL DualBeam

  • Low-voltage performance for high sample preparation quality
  • Ultra-high-resolution immersion-lens field-emission SEM column
  • Automated handling of 300 mm FOUP with EFEM (GEM300 compliant)

Helios 5 DualBeam

  • Fully automated, high-quality, ultra-thin TEM sample preparation
  • High throughput, high resolution subsurface and 3D characterization
  • Rapid nanoprototyping capabilities

Helios 5 PFIB DualBeam

  • Gallium-free STEM and TEM sample preparation
  • Multi-modal subsurface and 3D information
  • Next-generation 2.5 μA xenon plasma FIB column

Helios 5 Hydra DualBeam

  • 4 fast switchable ion species (Xe, Ar, O, N) for optimized PFIB processing of a widest range of materials
  • Ga-free TEM sample preparation
  • Extreme high resolution SEM imaging

FIB-SEM and Laser Ablation

  • All three beams have same coincident point for accurate and repeatable cut placement
  • Millimeter-scale cross sections with up to 15,000x faster material removal than a typical FIB
  • Statistically relevant deep subsurface and 3D data analysis

Arctis Cryo-Plasma-FIB

  • Correlation to light microscopy and relocation in TEM
  • High-quality lamellae with consistent thickness
  • Automated high throughput and connectivity for cryo-tomography

Aquilos 2 Cryo-FIB

  • Automation enables production of multiple lamellas
  • Target and extract your structure of interest with lift-out nano-manipulator
  • 3D visualization for high-resolution tomography

Scios 2 DualBeam

  • Full support of magnetic and non-conductive samples
  • High throughput subsurface and 3D characterization
  • Advanced ease of use and automation capabilities

Axia ChemiSEM

  • Live quantitative elemental mapping
  • High fidelity scanning electron microscopy imaging
  • Flexible and easy to use, even for novice users
  • Easy maintenance

Verios 5 XHR SEM

  • Monochromated SEM for sub-nanometer resolution over the full 1 keV to 30 keV energy range
  • Easy access to beam landing energies as low as 20 eV
  • Excellent stability with piezo stage as standard

Quattro ESEM

  • Ultra-versatile high-resolution FEG SEM with unique environmental capability (ESEM)
  • Observe all information from all samples with simultaneous SE and BSE imaging in every mode of operation

Prisma E SEM

  • Entry-level SEM with excellent image quality
  • Easy and quick sample loading and navigation for multiple samples
  • Compatible with a wide range of materials thanks to dedicated vacuum modes

Apreo 2 SEM

  • High-performance SEM for all-round nanometer or sub-nanometer resolution
  • In-column T1 backscatter detector for sensitive, TV-rate materials contrast
  • Excellent performance at long working distance (10 mm)

VolumeScope 2 SEM

  • Isotropic 3D data from large volumes
  • High contrast and resolution in high and low vacuum modes
  • Simple switch between normal SEM use and serial block-face imaging

Phenom Pharos G2 Desktop FEG-SEM

  • FEG source with 1 - 20 kV acceleration voltage range
  • <2.0 nm (SE) and 3.0 nm (BSE) resolution @ 20 kV
  • Optional fully integrated EDS and SE detector

Phenom XL G2 Desktop SEM

  • For large samples (100x100 mm) and ideal for automation
  • <10 nm resolution and up to 200,000x magnification; 4.8 kV up to 20 kV acceleration voltage
  • Optional fully integrated EDS and BSE detector

Phenom ParticleX Battery Desktop SEM

  • Versatile solution for high-quality, in-house analysis
  • Automated system and analysis of multiple samples
  • Testing 10x faster

Phenom ProX G6 Desktop SEM

  • High performance desktop SEM with integrated EDS detector
  • Resolution <6 nm (SE) and <8 nm (BSE); magnification up to 350,000x
  • Optional SE detector

Phenom Pro G6 Desktop SEM

  • High performance desktop SEM
  • Resolution <6 nm (SE) and <8 nm (BSE); magnification up to 350,000x
  • Optional SE detector

Phenom Pure G6 Desktop SEM

  • Entry level desktop SEM
  • Resolution <15 nm; magnification up to 175,000x
  • Longlife CeB6 source

Phenom Perception GSR Desktop SEM

  • Dedicated automated GSR desktop SEM
  • Resolution <10 nm; magnification up to 200,000x
  • Longlife CeB6 source

Phenom ParticleX AM Desktop SEM

  • Versatile desktop SEM with automation software for Additive Manufacturing
  • Resolution <10 nm; magnification up to 200,000x
  • Optional SE detector

Phenom ParticleX TC Desktop SEM

  • Versatile desktop SEM with automation software for Technical Cleanliness
  • Resolution <10 nm; magnification up to 200,000x
  • Optional SE detector

Phenom ParticleX Steel Desktop SEM

  • SEM and EDS integrated
  • Ease of use
  • Sub-micrometer inclusions

ELITE System

  • Electrical defect localization
  • Thermal mapping
  • Advanced packaging analysis

Hyperion II System

  • Atomic Force Probing
  • Localize transistor faults
  • Integrated PicoCurrent (CAFM)

nProber IV System

  • Localize transistor and BEOL faults
  • Thermal nanoprobing (-40°C to 150°C)
  • Semi-automated operation

Meridian S System

  • Fault Diagnostic with Active Probe Technology
  • Static laser stimulation (SLS / OBIRCH) and photon emission options
  • Supports both micro-probing and probe card device stimulation

Meridian WS-DP System

  • High-sensitivity, low-noise, low-voltage photon emission detection with broadband DBX or InGaAs camera systems
  • Multi-wavelength laser scanning microscope for scan chain analysis, frequency mapping, transistor probing and isolation of faults

Meridian 7 System

  • Dynamic Optical Fault Isolation for 10nm node and below
  • High resolution visible and Infrared light
  • High-yield sample preparation to 5μm widely available

Meridian IV System

  • High sensitivity extended-wavelength DBX photon emission detection
  • Standard InGaAs photon emission detection
  • Laser Scanning Microscope with multiple wavelength options

Centrios Circuit Edit System

  • Superior image / milling resolution
  • Enhanced milling precision and control
  • Built on the Thermo Scientific Helios DualBeam platform

Centrios HX Circuit Edit System

  • Cutting-edge circuit editing for advanced semiconductor nodes with the latest FIB technology
  • Unparalleled milling precision and control with low landing energy to preserve sensitive circuits
  • Advanced navigation and ion beam placement accuracy

MK.4TE ESD and Latch-Up Test System

  • Rapid-relay-based operations—up to 2304 channels
  • Advanced device preconditioning with six separate vector drive levels
  • Fully compliant Latch-Up stimulus and device biasing

Orion3 Electrostatic Discharge Tester

  • Charged device model testing
  • Dual high resolution color cameras
  • Test densities to less than 0.4mm pitch

Celestron Test System

  • Wafer and package level TLP testing
  • High current TLP pulse generator
  • Can be interfaced with semiautomatic probers
  • Intuitive software for control and report generation

Pegasus ESD Test System

  • Testing per the latest industry standards
  • True system level ESD 150pF/330Ω network
  • 2 pin connection via wafer probes to any device

Nexsa

  • Micro-focus X-ray sources
  • Unique multi-technique options
  • Dual-mode ion source for monoatomic & cluster ion depth profiling

K-Alpha

  • High resolution XPS
  • Fast, efficient, automated workflow
  • Ion source for depth profiling

ESCALAB QXi XPS

  • High spectral resolution
  • Multi-technique surface analysis
  • Extensive sample preparation and expansion options

Vitrobot System

  • Fully Automated Sample vitrification
  • Blotting Device
  • Semi-Automated Grid Transfer
  • High Sample Throughput

CleanMill System

  • Broad ion beam milling and polishing
  • Wide acceleration voltage range
  • Cryogenic sample preparation
  • CleanConnect compatible

Amira Software

  • Support for multi-data/view/channel
  • Interactive high-quality visualization
  • Machine Learning-based segmentation
  • Intuitive recipe creation

Athena Software

  • Ensure traceability of images, data, metadata and experimental workflows
  • Simplify your imaging workflow
  • Improve collaboration
  • Secure and manage data access

Auto Slice & View 5 Software
 

  • Automated serial sectioning for DualBeam
  • Multi-modal data acquisition (SEM, EDS, EBSD)
  • On-the-fly editing capabilities

AutoScript 4 Software

  • improved reproducibility and accuracy
  • Unattended, high throughput imaging and patterning
  • Supported by Python 3.5-based scripting environment

AutoScript TEM Software

  • Provides a direct link between research needs and microscope automation
  • Enables improved reproducibility and accuracy
  • Focuses time on the microscope for higher throughput

AutoTEM 5 Software

  • Fully automated in situ S/TEM sample preparation
  • Support of top-down, planar and inverted geometry
  • Highly configurable workflow
  • Easy to use, intuitive user interface

Avizo Software

  • Support for multi-data/multi-view, multi-channel, time series, very large data
  • Advanced multi-mode 2D/3D automatic registration
  • Artifact reduction algorithms

Smart EPU Software

  • Microscope-embedded solution for single particle acquisition
  • Optimized for high-throughput particle collection, providing real-time image analysis
  • Includes components for scheduling, data acquisition, and decision algorithms

Embedded CryoSPARC Live

  • Real-time, multidimensional feedback on sample quality and instrument settings
  • Adjust imaging and processing based on real-time information
  • Fully integrated with Smart EPU Software

iFast Software

  • Macro recorder for faster recipe creating
  • Runner for unattended overnight operation
  • Alignment tools: Image recognition and edge finding

Inspect 3D Software

  • Image processing tools and filters for cross-correlation
  • Feature tracking for image alignment
  • Algebraic reconstruction technique for iterative projection comparison

Maps Software

  • Acquire high-resolution images over large areas
  • Easily find regions of interest
  • Automate image acquisition process

NEXS Software

  • Auto-syncs position/magnification between NEXS and Circuit Edit system for a more seamless user experience
  • Connects to most Thermo Scientific tools used for EFA, PFA and Circuit Edit space

Pergeos Software
Rocks and Minerals

  • Visualize, process, and analyze rock imagery data
  • Perform multi-scale imaging analysis from pore to core
  • Calculate geological and petrophysical properties

Tomography 5 Software

  • Automated multi-site batch tomography
  • Automatic cassette mapping
  • Dose symmetric tilt scheme for optimal electron dose
  • Fully integrated with Selectris Imaging Filters

Velox Software

  • An experiments panel on the left side of the processing window.
  • Live quantitative mapping
  • Interactive detector layout interface for reproducible experiment control and setup

3D Reconstruction

  • Intuitive user interface, maximum employability
  • Intuitive fully automated user interface
  • Based on 'shape from shading' technology, no stage tilt required

AsbestoMetric

  • Automated tool for image acquisition, fiber detection and reporting
  • Assisted EDX analysis with fiber revisiting
  • ISO standard report on asbestos analysis

Elemental Mapping

  • Fast and reliable information on the distribution of elements within the sample or the selected line
  • Easily exported and reported results

FiberMetric

  • Save time by automated measurements
  • Fast and automated collection of all statistical data
  • View and measure micro and nano fibers with unmatched accuracy

Nanobuilder

  • CAD-based prototyping
  • Fully automated job execution, stage navigation, milling, and deposition
  • Automated alignment and drift control

ParticleMetric

  • Integrated software for online and offline analysis
  • Correlating particle features such as diameter, circularity, aspect ratio and convexity
  • Creating image datasets with Automated Image Mapping

Phenom Programming Interface

  • Customize your SEM to fit your workflow
  • Increase efficiency and save time with automated processes
  • Control imaging settings and stage navigation

PoroMetric

  • Correlate pore features such as area, aspect ratio, major and minor axis
  • Acquire images directly from the Desktop SEM
  • Statistical data with high-quality images

ProSuite

  • Automated collection of images
  • Real-time remote control
  • Standard applications included: Automated Image Mapping + Remote User Interface

Quartz PCI/CFR

  • SEM imaging traceability compliant with 21 CFR Part 11
  • Compatible with the Phenom XL and Phenom Pro desktop SEMs
  • Windows 10 64-bit operating system support

μHeater

  • Ultra-fast heating solution for in situ high resolution imaging
  • Fully integrated
  • Temperatures up to 1200 °C

μPolisher

  • Potential to enable large number of novel, unexplored applications
  • Very low energy milling
  • Small spot size for precise local surface treatment

Selectris and Selectris X Imaging Filters

  • Designed for high stability and atomic resolution imaging
  • Straightforward operation
  • Paired with the latest generation Thermo Scientific Falcon 4 Direct Electron Detector

Ceta D Camera

  • Optimum performance at any high tension (20–300 kV)
  • Compatible with post-column filters and spectrometers
  • Movie acquisition for dynamic studies

Falcon 4i Detector

  • High thorughput for more images per hour
  • Unsurpassed imaging quality with high DQE
  • Lossless data compression with EER

Charge Reduction Sample Holder

  • Up to 8 times higher magnification
  • Faster sample preparation
  • Non conductive samples can be imaged in their natural state

Electrical Feedthrough Sample Holder

  • Connect electrical probes to the sample for in situ measurements
  • Sample can be height adjusted from 0–25 mm manually
  • Measurements of probe currents

Eucentric Sample Holder

  • Eucentric tilting and compucentric rotation on a desktop SEM
  • Fast time-to-image with sample loading < 1 minute
  • Real-time 3D sample visualization module

Filter Inserts

  • Filter residue analysis and asbestos analysis
  • Available in two models which support 47 mm (1.85 inch) and 25 mm (1 inch) filters
  • Use on Phenom Desktop SEM

Metallurgical Sample Holder

  • Designed to support resin-mounted samples
  • Preferred solution for metallurgy and when working with inserts
  • Sample size up to 32 mm diameter and 30 mm height

Micro Tool Sample Holder

  • Quick and fast clamping
  • Tilting and rotation allow for easy sample positioning
  • No extra tooling required for sample loading

Motorized Tilt & Rotation Sample Holder

  • Tilt range -10° to +45°
  • Continuous 360° compucentric rotation
  • Controlled by dedicated Motion Control ProSuite application

Nebula Particle Disperser

  • Standard method for uniform dry powder dispersion
  • Avoids particle clusters
  • Used with Phenom Desktop SEM

Resin Mount Inserts

  • A unique sample holder concept
  • Available in 3 models for supporting standard sized samples of 25 mm (~1 inch), 32 mm (~1 ¼ inch) and 40 mm (~1 ½ inch) diameter

Standard Sample Holder

  • Compact stage allowing analysis of samples of up to 100 mm x 100 mm
  • Can be extended with 3 types of resin or metallurgical mount inserts
  • Used with Phenom Desktop SEM

Sample Holder Inserts

  • Faster cross-sectional imaging of coatings and multilayer samples
  • Easy clamping without the need for screws or extra tools
  • Eliminates the need for screws and tools to clamp the sample

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Tensile Sample Holder

  • Determine batch quality
  • Determine manufacturing consistencys
  • Aid the design process

Temperature Controlled Sample Holder

  • Temperature range -25 °C to +50 °C
  • Temperature accuracy ±1.5 °C
  • Temperature display resolution 0.1 °C

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