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SPARK is a knowledge community where semiconductor professionals and industry thought leaders come together to share information on failure analysis, metrology and characterization techniques. Our webinars highlight the latest advances in semiconductor analysis, enabling you to stay at the forefront of an evolving technology and application landscape.
On-demand semiconductor industry webinars
Unleash the Power of Nanoprobing
In our on-demand webinar, John Sanders, Product Manager, Thermo Fisher Scientific, delves into the world of nProber IV System workflows. Gain valuable insights into how these workflows have become an essential element of advanced failure analysis and discover how they can enhance your own physical failure analysis processes.
Meridian EX Semiconductor Fault Isolation System
Watch this webinar to learn how the Meridian EX System:
- Helps you achieve a 10× spatial resolution improvement versus commercially available optical laser-based fault isolation solutions
- Eliminates “crosstalk” from adjacent circuits to deliver more reliable characterization data
- Enables you to capture dynamic data off metal interconnects, such as power distribution layers, which optical fault isolations systems cannot
Helios 6 HD FIB-SEM: The next generation of TEM sample preparation
In this on-demand webinar, you’ll learn how the Helios 6 HD FIB-SEM offers more system availability, more samples per hour, and more high-quality sample output than previous generations:
- Digital scanning and patterning engine that allows for simultaneous SEM imaging and milling to deliver improved scan rotation precision and improved cut placement accuracy.
- Thermo Scientific AutoTEM 6 Software that offers decreased setup time and many productivity and ease of use improvements.
- Thermo Scientific EasyLift NanoManipulator that enables longer intervals between needle changes and a reduction in needle replacement time.
Semiconductor Metrology and Process Characterization
Watch our on-demand webinar which introduces the Metrios 6 (S)TEM and explore its new features:
- Smart Stage—Automatically loads the sample and navigates to the region of interest
- Ultra-X EDS detection system—Delivers 2× faster high-efficiency elemental acquisition
- Constant power lens—Voltage switching in minutes versus hours
- Smart Automation—Ease of use, scalability and 50× faster model training
Pinpointing Power MOSFET Defects: An EFA to PFA Workflow Case Study
Find out how a Thermo Fisher customer improved power MOSFET quality and reliability with a fast and accurate workflow for identifying defects.
You will learn:
- About an EFA to PFA workflow designed for power MOSFETs fault analysis.
- How a Thermo Fisher Scientific customer applied this workflow.
- How localizing faults at the nanoscale can help you increase accuracy and accelerate defect analysis.
SPARK 3D Reconstruction in Semiconductors
In this SPARK on-demand webinar, you will learn about:
- The value of 3D reconstruction
- How to perform 3D reconstruction
- How other semiconductor companies use 3D reconstruction
Semiconductor Packaging Challenges
In this SPARK on-demand webinar, you will discover:
- Failure analysis, process metrology, and characterization challenges impacting advanced packaging devices
- Industry-leading assembly failure isolation and analysis workflows, and complete die analysis workflows
Identifying crystalline defects in compound semiconductors using Electron Channeling Contrast Imaging
In this SPARK webinar, you’ll discover how Electron Channeling Contrast Imaging (ECCI) is an optimal solution for imaging threading dislocation in monocrystals and defect visualization.
Introducing the Helios 5 Laser family
Watch this webinar to learn how the latest additions to the Thermo Scientific Helios 5 family of FIB-SEM systems can help you speed up large volume analysis. Now with an integrated femtosecond laser coincident with the scanning electron microscope and focused ion beam.
FIB Circuit Edit Semiconductor Webinar
This SPARK webinar introduces the Thermo Scientific Centrios Advanced Circuit Edit System, which delivers a new level of surgical precision for circuit editing the most advanced logic devices, including (GAA) FETs with EUV patterning and buried power rails.
TR-LADA for Dynamic OFI
Preserving sensitive circuit areas while delivering greater defect localization capabilities is what the new TR-LADA option can do for your Meridian Optical Fault Isolation system.
In this on-demand webinar, find out how TR-LADA can help you improve the productivity of your research. You’ll learn:
- About how TR-LADA enables users to quickly identify design fixes for marginal failing parts and improve yield
- How TR-LADA provides sensitive circuitry information without damaging the device or obscuring defects.
Process Metrology, Failure Analysis, and R&D Solutions for Information Display Technology
From VR headsets to television screens, displays play a vital role in your user experiences.
Watch our webinar to learn about:
- Information display technologies and their unique process metrology, FA, and R&D challenges
- Information about Thermo Fisher Scientific solutions to address process metrology, FA, and R&D challenges
Low kV Backside Circuit Edit Workflow
Or Haimson will share his current work at Annapurna Labs an Amazon company in partnership with Thermo Fisher Scientific on backside FIB circuit edit and advanced process nodes using a low energy focused ion beam. Learn how advances in failure analysis improves turnaround time, saving you time and money.
Automated Semiconductor Sample Preparation Webinar
Manual sampling can introduce errors. Instrument misalignments can impact cut placement accuracy. Producing ultra-thin samples on sub 3 nm nodes can be a highly complicated process. All of this can add up to slower sample turnaround and lost productivity.
What you will learn in this webinar:
- How machine learning for end-pointing helps control final cut thickness and location—supporting the highest-precision cut placements required for 5 nm and GAA process nodes.
- How improved automation helps scale operations and optimize technical resources.
- How enhanced ease-of-use increases sample throughput, analysis confidence, and productivity.
Introducing the Ultimate (S)TEM platform for Advanced Semiconductor Applications
Advanced semiconductor researchers and developers need atomic scale characterization capabilities to perform fast, repeatable, and damage-free analysis.
What will you learn in this webinar:
- About the new (S)TEM and its high-performance capabilities.
- How to eliminate beam damage with fast energy dispersive spectroscopy (EDS) and fast high tension (HT) switching capabilities.
- How the Ultra-X EDS detector system delivers fast and easy compositional analysis on advanced materials, light elements and thin specimens.
SPARK Webinar Series on semiconductor engineering, prototyping, and manufacturing advances
Testing new products for market, debugging designs, prototyping, increasing yield and optimizing process marginalities are daily challenges that semiconductor professionals confront. This SPARK webinar series gives you new insights into failure analysis and device innovations with dedicated tools. Learn how electrical failure analysis systems, (S)TEM solutions and dual-beam FIBs, and the latest logic and memory nanoprobing workflows make your profession life easier.
Semiconductor Failure Analysis Using Helios PFIB: Webinar
Advanced analytical tools specifically designed for failure analysis must be able to quickly handle sample preparation and isolate minor electrical or physical defects – defects that can destroy device performance, reliability, and yield.
What will you learn in this webinar:
- Learn how the Helios 5 PFIB supports high throughput preparation of advanced logic, 3D memory and packages.
- Discover how the Helios 5 PFIB delivers unique, automated delayering of memory and logic devices.
- Gain an understanding of how SmartAlign and SEMFLASH increase productivity.
Semiconductor Sample Preparation for Atom Probe Tomography Webinar
Advances in semiconductor design mean smaller and more complex architectures are used in the manufacturing process. Atom probe tomography is used in characterizing these architectures, as it enables accurate visualization and analysis at high resolution.
However, in order to precisely characterize samples using atom probe tomography, clean and uniform sample preparation is necessary. This is difficult to achieve using current high kV cleaning methods, because these techniques damage the sample surface.
What will you learn in this webinar:
- Learn about a precise, low kV cleaning process for atom probe tomography – a method that delivers clean, high quality samples, as well as better depth control to reach the region of interest (ROI).
- Learn how this process can automate atom probe tomography sample preparation, increasing productivity for users.
Automating TEM Metrology
In this on-demand SPARK Webinar, Automating TEM Metrology, we discuss the advanced automation capabilities of the Thermo Scientific Metrios AX TEM. We explore the critical roles that artificial intelligence (AI) and machine learning (ML) play, and we share learnings to help you automate your TEM sample prep processes. We also show the TEM metrology output on gate-all-around structures.
Transmission Electron Microscopy Fundamentals
This webinar series from Thermo Fisher Scientific will cover the fundamentals of transmission electron microscopy (TEM) and scanning transmission emission microscopy, specifically how they relate to semiconductors. Topics covered include TEM imaging, elemental analysis, STEM vs TEM, TEM metrology, and other TEM applications for semiconductor production and analysis.
Advanced packaging: wafer-level defect analysis and metrology
In this webinar, we explore the Thermo Scientific Helios 5 PXL Wafer DualBeam unique value and capabilities of process metrology and defect analysis to address wafer-level packaging challenges.
This webinar provides:
- An overview of advanced packaging challenges
- An overview of Thermo Fisher process metrology and failure analysis solutions for advanced packaging
- Information on the unique challenges for through-silicon vias (TSV) process metrology and defect analysis workflows
- An introduction of the Helios 5 PXL and its unique capabilities for the advanced packaging market
Sample preparation and TEM imaging techniques for advanced power devices
This webinar utilizes real-world use cases to discuss defects in devices and crystalline dislocations in substrates, cross-section and TEM lamella focused ion beam sample preparation, and the performance advantages of ion sources other than Ga+. We also dive into the complexities and crucial requirements associated with (S)TEM analysis.
What will you learn?
- Methods for identifying and root causing defects in power devices and substrates
- Techniques to improve cross-section and TEM lamella quality
- The performance advantages of alternative ion sources such as argon and xenon
- Key TEM analysis techniques for analyzing advanced power devices and materials.
Automated STEM-EDS Metrology and Characterization of DRAM Capacitors
In this webinar, we present a scanning transmission electron microscopy (STEM) based, energy dispersive X-ray spectroscopy (EDS) metrology method enabled by the Thermo Scientific Metrios 6 (S)TEM and its new Ultra-X EDS detector. The Ultra-X EDS detector provides a 4.45 srad solid angle, delivering at least 2x greater data collection efficiency than the previous generations of detectors. High-quality analytical information and fast EDS data collection is provided through improved sensitivity, efficiency, and throughput capabilities.
Wafer DualBeam workflow accelerates time to data versus traditional lab workflows
In this webinar, we discuss the benefits of using a wafer DualBeam instrument to obtain actionable data faster to facilitate fab process improvements. We elaborate on the automation and unique capabilities of the Thermo Scientific Helios 5 EXL Wafer DualBeam for cross-section analysis and TEM sample preparation workflows. We also discuss the results of TEM sample preparation supporting advanced node device analysis.
The Advantages of Multi-Ion Species Plasma FIB Milling
Watch our webinar to learn how the Thermo Scientific Helios Hydra PFIB DualBeam’s selectable-species FIB enables highly efficient sample preparation across a wide variety of materials and length scales, from precise TEM sample preparation to the creation of large-volume, high-quality SEM data sets.
Semiconductor TEM Fundamentals Elemental Analysis
In this webinar, we present examples of such analysis, explain the basic characteristics of energy dispersive X-ray spectroscopy (EDS) and electron energy loss spectroscopy (EELS), and we highlight how these methods offer complementary data. Following from their basic characteristics, we examine how EDS and EELS can be optimized to achieve the best output from each of them.
Accelerating S/TEM defect analysis and metrology efficiency
In this webinar, we explore the implementation of a new interactive workflow driven by machine learning-based "Smart Automation" technology, which accelerates time to S/TEM results on novel semiconductor devices while reducing operator burden. We dive into how an interactive automated approach enhances the flexibility of Smart Automation to better handle your dynamic requests and how it expands the coverage of various sample types, complementing a fully automated workflow.
Style Sheet for Global Design System
Style Sheet for Komodo Tabs