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Advanced logic manufacturing is becoming increasingly complex with the revolution of gate-all-around transistor technology; however, this revolution presents unique challenges in metrology, defect analysis, and failure analysis. Thermo Fisher Scientific offers innovative workflow solutions in fault localization, sample preparation, imaging, and analysis to address these challenges. Our innovative solutions empower you to achieve high-resolution metrology for critical dimension measurements and to accurately characterize yield-limiting defects, leading to accelerated yield learning cycles, improved production yield, and enhanced device performance.
Comprehensive examination and evaluation of advanced logic device structures encompass various techniques and tools to measure critical dimensions, electrical performance, and material characteristics, aiming to ensure high-quality manufacturing processes, identify potential defects or failures, and ultimately optimize device performance and reliability.
Electrical measurements, material analysis, and imaging techniques are used to precisely evaluate the performance, reliability, and functionality of advanced logic device structures, enabling understanding of their electrical properties, physical attributes, and potential limitations, ultimately facilitating the advancement of advanced logic transistor technologies.
For Research Use Only. Not for use in diagnostic procedures.