Advanced Logic Device Analysis Resources

Semiconductor analysis resources from Thermo Fisher Scientific

Welcome to our resource webpage dedicated to providing you with the latest insights and information on metrology, defect analysis, and failure analysis solutions for advanced logic transistor manufacturing. Whether you are a seasoned industry professional or just starting out in the field, this is the perfect place to stay up to-date with the latest trends and technologies. From in-depth technical discussions to practical tips and advice, our resources are designed to help you navigate the complex world of metrology and defect analysis with ease.

SPARK semiconductor webinars

Wafer DualBeam workflow accelerates time to data versus traditional lab workflows


Using full wafer defect and process monitoring workflows in the fab can provide faster time to data. Preservation of wafer integrity during analysis enables the tracking of multiple data points from a single wafer. The unique capabilities of the Thermo Scientific Helios 5 EXL Wafer DualBeam provide flexible automation and address sample preparation challenges.

Automation, precision, and throughput: Introducing the next-generation scanning transmission electron microscope


The Thermo Scientific Metrios 6 Scanning Transmission Electron Microscope is a next-generation, fully automated metrology solution featuring a new stage, EDS detection system, lens, and source technologies. This combination enhances productivity and quickly delivers high-confidence, accurate data to accelerate chip development.

Breaking the 5 nm barrier

 

The Thermo Scientific Meridian EX System introduces a new era of advanced semiconductor fault isolation by using cutting-edge electron beam technology to probe the device under test with a much finer resolution. The Meridian EX System enables you to capture dynamic data off metal interconnects, such as power distribution layers, which optical fault isolations systems cannot.

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Semiconductor industry leaders' interviews

Helios 6 HD FIB-SEM


In this interview, Michael Rauscher talks about how the Helios 6 HD FIB-SEM meets the trends in electron microscopy and the importance of repeatability when dealing with large volumes of TEM data.

 

Meridian EX Fault Isolation System


In this video, Praveen Vedagarbha discusses what makes the Meridian EX System a unique e-beam probing solutions for advanced logic failure analysis.

 

Semiconductor device analysis white papers

Failure analysis on advanced logic devices: Multiple inflection points are affecting the entire FA ecosystem

 

Discover advanced techniques for failure analysis in modern logic devices. This white paper highlights the importance of understanding failure mechanisms to improve device reliability. The document covers various analytical methods, including electron microscopy and focused ion beam systems, to investigate and resolve issues at the nanoscale level, ultimately enhancing the performance and longevity of electronic components.

Semiconductor device analysis blogs

Automated Metrology Becomes a Reality with New Scanning Transmission Electron Microscope

 

This blog post discusses the advantages of using a scanning transmission electron microscope ((S)TEM) for automated metrology in semiconductor manufacturing. It emphasizes how automated S/TEM enhances precision, efficiency, and throughput in measuring and analyzing semiconductor materials at the atomic level. The technology aids in ensuring quality control and optimizing production processes in the semiconductor industry.

SPARK semiconductor webinars

Semiconductor learning center

For Research Use Only. Not for use in diagnostic procedures.