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FIB-SEM MICROSCOPES
FIB-SEM and Laser Ablation
Combined focused ion beam milling and laser ablation tools.
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Focused ion beam milling and femtosecond laser ablation
Thermo Scientific Helios 5 PFIB Laser Systems combine plasma focused ion beam milling with femtosecond laser ablation and SEM (scanning electron microscopy) imaging. This “TriBeam” combination enables high-resolution imaging and analysis with in situ ablation capability, offering unprecedented material removal rates for fast millimeter-scale characterization at nanometer resolution.
The femtosecond laser can cut many materials at rates that are orders of magnitude faster than a typical FIB. A large cross-section (hundreds of micrometers) can be created in less than five minutes. Because the laser has a different removal mechanism (ablation versus the ion sputtering of FIB), it can easily process challenging materials, such as non-conductive or ion-beam-sensitive samples.
The extremely short duration of the femtosecond laser pulses introduces almost no artifacts such as heat impact, microcracking, melting, or those typical of traditional mechanical polishing. In most cases, the laser-milled surfaces are clean enough for direct SEM imaging and even for surface-sensitive techniques such as electron backscatter diffraction (EBSD) mapping.
We offer a broad product portfolio and advanced automation capabilities for applications such as transmission electron microscopy (TEM) sample preparation, atom probe tomography (APT) sample preparation, and 3D structural analysis.
Transmission electron microscopy and atom probe tomography sample preparation
Built on the proven Helios 5 DualBeam platform, these instruments incorporate a suite of state-of-the-art technologies to provide high-performance, high-resolution transmission electron microscopy (TEM) and atom probe tomography (APT) sample preparation and extremely high-resolution SEM imaging with precise materials contrast.
3D Structural analysis
When combined with Thermo Scientific Auto Slice & View Software, TriBeam instruments provide 3D insight into sample structure by selectively removing (milling) the material for subsurface characterization. Digital reconstruction generates multi-modal 3D datasets that can consist of a variety of signals, including backscattered electron (BSE) imaging for maximum materials contrast, energy dispersive spectroscopy (EDS) for compositional information, and electron backscatter diffraction (EBSD) for microstructural and crystallographic information. The SEM capability of TriBeam instruments offers nanoscale details across a wide range of working conditions, from structural information obtained at 30 keV in STEM mode to charge-free, detailed surface information at lower energies. With unique in-lens detectors, TriBeam systems are designed for simultaneous acquisition of angular/energy-selective secondary-electron and BSE data. Fast, accurate, and reproducible results are provided by our unique SEM column design, which features fully automated lens alignments.
Helios 5 Laser FIB-SEM Product Family
Thermo Fisher Scientific offers a broad range of (P)FIB-SEM systems with fully integrated femtosecond lasers. This TriBeam product family consists of three models, all featuring the best-in-class Thermo Scientific Elstar SEM Column, a high-precision 150 mm piezo stage, and a large chamber. The main difference between these models is the FIB column:
- Helios 5 Laser System comes with high-throughput Tomahawk HT FIB
- Helios 5 Laser PFIB System has a high-performance Xe+ PFIB column
- Helios 5 Laser Hydra System is a unique solution featuring multi-ion species PFIB technology
15,000x faster rate of material removal via laser
Millimeter-scale cross sections with up to 15,000x faster material removal than a typical focused ion beam.
Statistically relevant subsurface and 3D data analysis
Data acquisition for much larger volumes within a shorter amount of time.
Accurate and repeatable cut placement
Same coincident point for all tree beams (SEM / (P)FIB / laser) enables accurate and repeatable cut placement and 3D characterization.
Fast characterization of deep subsurface features
Extraction of subsurface TEM lamella or chunks for 3D analysis.
High throughput processing of challenging materials
Includes non-conductive or ion-beam-sensitive samples.
Fast and easy characterization of air-sensitive samples
No need to transfer samples between different instruments for cross-sectioning and imaging.
Shares all capabilities of the Helios 5 platform
High-quality TEM and APT sample preparation and high-resolution imaging capabilities.
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| Laser specifications | ||
|---|---|---|
| Laser integration |
| |
| First Harmonic |
| 1030 nm (IR) <280 fs |
| Second Harmonic |
| 515 nm (green) |
| Optics |
|
|
| Repetition rate | • 1 kHz – 1 MHz | |
| Beam position accuracy | • <250 nm | |
| Protective shutter | • Automated SEM/PFIB protective shutter | |
| Software | • Laser control software | |
| Safety | • Interlocked laser enclosure (Class 1 laser safety) | |
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On demand webinar: Discover the all new Helios 5 Laser PFIB
Register for our recorded webinar and learn how the combination of fs-Laser and PFIB provides mm-scale subsurface and 3D analysis at nm resolution and enables new workflows such as fast characterization of air sensitive samples and multi-scale correlative microscopy with deep subsurface sample extraction.
Latest application developments of multiple ion species plasma FIB technology
Register for our live webinar and learn how leading research labs are using our new Thermo Scientific Helios 5 Laser PFIB and Thermo Scientific Helios 5 Hydra DualBeam to advance their materials characterization.
3D reconstruction of a solder bump acquired with the Helios 5 Laser PFIB System.
Large area cross-section of a GPU stack created with the Helios 5 Laser PFIB System. A fast polishing step with the plasma FIB allows you to resolve fine details at the nanometer scale.
Cross-section of a nylon sample. This material is challenging for FIB milling as it is non-conductive and beam sensitive, but it can easily be processed with the femtosecond laser.
Large-volume 3D reconstruction of a carbon-fiber-reinforced epoxy composite. The data was acquired using the Helios 5 Laser PFIB System, then processed and visualized with Avizo Software.
Large area (0.6 mm) cross-section of an additive manufacturing steel, milled by the femtosecond laser in less than 5 minutes.
Large volume 3D EBSD reconstruction of a nickel superalloy sample. The data was acquired with the Helios 5 Laser PFIB System.
Cross-sections of glass fibers. The femtosecond laser offers improved processing performance for challenging (non-conductive, thermally sensitive, shock-sensitive) materials such as this.
Large-area cross-section of a packaged solid-state battery. The Helios 5 Laser PFIB System enables fast characterization of air-sensitive materials by combining millimeter-scale cross-sectioning with high-resolution SEM imaging in the same vacuum chamber, eliminating the need for sample transfer.
On demand webinar: Discover the all new Helios 5 Laser PFIB
Register for our recorded webinar and learn how the combination of fs-Laser and PFIB provides mm-scale subsurface and 3D analysis at nm resolution and enables new workflows such as fast characterization of air sensitive samples and multi-scale correlative microscopy with deep subsurface sample extraction.
Latest application developments of multiple ion species plasma FIB technology
Register for our live webinar and learn how leading research labs are using our new Thermo Scientific Helios 5 Laser PFIB and Thermo Scientific Helios 5 Hydra DualBeam to advance their materials characterization.
3D reconstruction of a solder bump acquired with the Helios 5 Laser PFIB System.
Large area cross-section of a GPU stack created with the Helios 5 Laser PFIB System. A fast polishing step with the plasma FIB allows you to resolve fine details at the nanometer scale.
Cross-section of a nylon sample. This material is challenging for FIB milling as it is non-conductive and beam sensitive, but it can easily be processed with the femtosecond laser.
Large-volume 3D reconstruction of a carbon-fiber-reinforced epoxy composite. The data was acquired using the Helios 5 Laser PFIB System, then processed and visualized with Avizo Software.
Large area (0.6 mm) cross-section of an additive manufacturing steel, milled by the femtosecond laser in less than 5 minutes.
Large volume 3D EBSD reconstruction of a nickel superalloy sample. The data was acquired with the Helios 5 Laser PFIB System.
Cross-sections of glass fibers. The femtosecond laser offers improved processing performance for challenging (non-conductive, thermally sensitive, shock-sensitive) materials such as this.
Large-area cross-section of a packaged solid-state battery. The Helios 5 Laser PFIB System enables fast characterization of air-sensitive materials by combining millimeter-scale cross-sectioning with high-resolution SEM imaging in the same vacuum chamber, eliminating the need for sample transfer.
Controle de qualidade
O controle de qualidade e a garantia de qualidade são essenciais na indústria moderna. Oferecemos uma gama de ferramentas de microscopia eletrônica e espectroscopia para análises multidimensionais e multimodais de defeitos, permitindo que você tome decisões confiáveis e informadas para controle e melhoria de processos.
Pesquisa de materiais fundamentais
Novos materiais são investigados em escalas cada vez menores para o máximo controle de suas propriedades físicas e químicas. A microscopia eletrônica fornece aos pesquisadores percepções importantes sobre uma ampla variedade de características materiais em escala micro a nano.
Caracterização de materiais 3D
O desenvolvimento de materiais muitas vezes requer caracterização 3D em várias escalas. Os instrumentos DualBeam permitem a secção em série de grandes volumes e a subsequente geração de imagens SEM nanométricas, que podem ser processadas em reconstruções 3D de alta qualidade da amostra.
Preparação de amostra (S)TEM
Os microscópios DualBeam permitem a preparação de amostras ultrafinas e de alta qualidade para análise de (S)TEM. Graças à automação avançada, os usuários com qualquer nível de experiência podem obter resultados de nível especializado para uma ampla gama de materiais.
Preparação de amostra APT
A tomografia por sonda atômica (APT) fornece análise de composição de resolução atômica 3D de materiais. A microscopia de feixe de íons focalizados (FIB) é uma técnica essencial para a preparação de amostra de alta qualidade, orientada e específica de local para a caracterização APT.
Corte transversal
O corte transversal fornece dados adicionais ao revelar informações de subsuperfície. Os instrumentos DualBeam apresentam excelentes colunas de feixe de íons focalizados para corte transversal de alta qualidade. A automação permite realizar o processamento autônomo de amostras com alta produtividade.
Experimentação in situ
A observação direta e em tempo real de alterações microestruturais com a microscopia eletrônica é necessária para entender os princípios subjacentes de processos dinâmicos, como recristalização, crescimento de grãos e transformação de fases durante o aquecimento, o resfriamento e a umidificação.
Análise em várias escalas
Os materiais novos precisam ser analisados em resolução cada vez maior, mantendo o contexto maior da amostra. A análise em várias escalas permite correlacionar várias ferramentas e modalidades de geração de imagens, como a microTC de raios X, DualBeam, laser PFIB, SEM e TEM.
Caracterização de materiais 3D
O desenvolvimento de materiais muitas vezes requer caracterização 3D em várias escalas. Os instrumentos DualBeam permitem a secção em série de grandes volumes e a subsequente geração de imagens SEM nanométricas, que podem ser processadas em reconstruções 3D de alta qualidade da amostra.
Preparação de amostra (S)TEM
Os microscópios DualBeam permitem a preparação de amostras ultrafinas e de alta qualidade para análise de (S)TEM. Graças à automação avançada, os usuários com qualquer nível de experiência podem obter resultados de nível especializado para uma ampla gama de materiais.
Preparação de amostra APT
A tomografia por sonda atômica (APT) fornece análise de composição de resolução atômica 3D de materiais. A microscopia de feixe de íons focalizados (FIB) é uma técnica essencial para a preparação de amostra de alta qualidade, orientada e específica de local para a caracterização APT.
Corte transversal
O corte transversal fornece dados adicionais ao revelar informações de subsuperfície. Os instrumentos DualBeam apresentam excelentes colunas de feixe de íons focalizados para corte transversal de alta qualidade. A automação permite realizar o processamento autônomo de amostras com alta produtividade.
Experimentação in situ
A observação direta e em tempo real de alterações microestruturais com a microscopia eletrônica é necessária para entender os princípios subjacentes de processos dinâmicos, como recristalização, crescimento de grãos e transformação de fases durante o aquecimento, o resfriamento e a umidificação.
Análise em várias escalas
Os materiais novos precisam ser analisados em resolução cada vez maior, mantendo o contexto maior da amostra. A análise em várias escalas permite correlacionar várias ferramentas e modalidades de geração de imagens, como a microTC de raios X, DualBeam, laser PFIB, SEM e TEM.
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