PFIB SEM with the Helios 5 Hydra DualBeam

 

The Thermo Scientific Helios 5 Hydra DualBeam (plasma focused ion beam scanning electron microscope, PFIB-SEM) is a versatile multi-application tool that has four different ion species (argon, nitrogen, oxygen, and xenon), allowing you to choose the ions that provide the best results for samples including metals,batteries, semiconductors, fiber composites, and biological tissues. Great results start with sample preparation whether you are performing scanning transmission electron microscopy (STEM) and transmission electron microscopy (TEM) sample preparation, 3D characterization, large area failure analysis, volume electron microscopy or cellular cryo-tomography.

You can switch easily between argon, nitrogen, oxygen, and xenon in under ten minutes without sacrificing performance. This unprecedented flexibility significantly expands the potential application space of PFIB and enables research of ion-sample interactions to optimize existing use cases.

The Helios 5 Hydra DualBeam combines the new, innovative multi-ion-species plasma FIB (PFIB) column with the monochromated Thermo Scientific Elstar UC+ SEM Column to provide advanced focused ion- and electron-beam performance. Intuitive software and an unprecedented level of automation and ease-of-use allow observation and analysis of relevant subsurface volumes.

3D reconstruction of mouse brain tissue embedded in LR White (acrylic-based) resin acquired with an O+ ion beam and Auto Slice and View Software.

3D reconstruction of an automotive oil filter casing (polymer/glass fiber composite) acquired with an O+ ion beam and Auto Slice and View Software.

3D Reconstruction of High Bandwidth Memory Package by Plasma FIB Slice and View

Helios 5 Hydra DualBeam Benefits

Multiple plasma ion species

Multiple plasma ion species

Allows multi-application labs to quickly switch between four ion species (Xe, Ar, O, and N) to optimize for samples ranging from silicon and metals to cells

Ga Free TEM

Ga+ Free TEM

Facilitates fast and easy preparation of high-quality samples, including Ga+ free TEM, atom probe tomography, and resin-embedded samples

3D Tomography

3D tomography

Performs high-resolution, large volume, 3D tomography and combines multi-modal subsurface 3D information (SEM, EDS, EBSD)

Cryogenic conditions

Cryogenic conditions

Delivers high-resolution SEM images with high contrast even at cryogenic conditions for biological samples

Precise milling control

Precise milling control

Provides precise control of your milling experiments with time-saving automated software and workflow-based solutions

Helios 5 Hydra DualBeam Features

Multiple ion species for optimized PFIB results

The Helios 5 Hydra DualBeam is an all-in-one instrument with a unique multiple ion species PFIB column with four ion species (Xe, Ar, O, N) to be used as a primary beam with a patented, automated, fast, and easy switching capability (<10 minutes). The Helios 5 Hydra PFIB is Ga-ion free, which is vital for sensitive samples such as aluminum-containing materials or compound semiconductors, like Sic or GaN. The multiple ion options increase throughout and do not require complex accessories to improve cut face quality (e.g., milling curtain mitigation) for a wide range of materials.



Serial section electron microscopy with Auto Slice & View Software

Combined with optional Auto Slice & View Software, the Helios Hydra DualBeam offers high throughput and fully automated 3D data collection, even at cryogenic temperatures. Large volume analysis can be limited by cross-sectional information alone, but 3D characterization of buried features for failure analysis or metrology provides a complete picture. The automated workflow enhances throughput and ease of use, even for challenging materials with complex structures or defects.


PFIB spin mill for large planar milling and imaging

The optional Spin Mill method on the Helios 5 Hydra DualBeam provides large-area planar milling up to 1 mm in diameter  for polished surface imaging, 3D characterization, or buried defect inspection. The Spin Mill process is fully automated and easy to set up using Auto Slice & View Software. A key advantage is the range of materials where this method is effective. Spin mill can be a preparation method for advanced semiconductor device delayering and inspection workflows, allowing removal of thick metallization. For resin-embedded life science samples, the spin mill method can be used to ablate the sample over a large area to locate and image target regions at high resolution


PFIB Delayering for inspection and failure analysis

The unique combination of Helios 5 Hydra xenon plasma FIB technology and proprietary Thermo Scientific Dx chemistry enables damage-free delayering of semiconductor devices, including advanced logic samples and 3D NAND memory devices. Automatic de-processing allows access to buried information for advanced devices that would otherwise be unattainable. Thermo Fisher Scientific's unique Plasma FIB delayering process complements the nProber IV and Hyperion II, delivering a robust nanoprobing and transistor characterization workflow.


Fast milling for large volume multi-modal 3D tomography

Subsurface or three-dimensional characterization is often required to better understand material properties. In many cases, large volumes inaccessible by conventional Ga+ FIB instruments are necessary to obtain representative and relevant results. The excellent high-current performance of the Helios 5 Hydra PFIB with optional Thermo Scientific Auto Slice & View Software empowers the fully automated acquisition of large volume 3D datasets in a multitude of modalities. This includes backscattered electron (BSE) imaging for maximum materials contrast, energy dispersive spectroscopy (EDS) for compositional information, and electron backscatter diffraction (EBSD) for crystallographic information.



Helios 5 Hydra DualBeam Documents

 

Datasheets
Applications notes

Related FIB SEM DualBeam systems and resources

 

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Helios 5 Hydra DualBeam resources

3D reconstruction of an automotive oil filter casing, acquired with the Helios Hydra DualBeam and Auto Slice & View 4 Software for automated serial sectioning. Horizontal field width = 350 µm.

3D reconstruction of a mouse brain tissue acquired with a Helios Hydra UX DualBeam using O+ focused ion beam. Sample preparation: Conventional cemical fixation. Epon resin. 721 slices (thickness ~ 4 nm). HFW 16.4 µm (xy resolution 5x4 nm). Acquisition time ~ 17 h.

Hydra's unique multi-ion beam technology enables the precise and efficient analysis of buried defects in semiconductor packaged die and power devices

3D reconstruction of Caenorhabditis elegans L1 with a Helios Hydra CX DualBeam using O+ focused ion beam. Sample preparation: high pressure frozen and freeze substituted and HM20 embedded. Tomogram of a 30 × 30 × 15 µm (resolution ~10 x ×10 x ×15 nm). Acquisition time ~ 16 h. Courtesy Dr. Alex DeMarco, Monash University, Australia.
https://www.biorxiv.org/content/10.1101/457820v1.full.pdf

3D reconstruction of an automotive oil filter casing, acquired with the Helios Hydra DualBeam and Auto Slice & View 4 Software for automated serial sectioning. Horizontal field width = 350 µm.

3D reconstruction of a mouse brain tissue acquired with a Helios Hydra UX DualBeam using O+ focused ion beam. Sample preparation: Conventional cemical fixation. Epon resin. 721 slices (thickness ~ 4 nm). HFW 16.4 µm (xy resolution 5x4 nm). Acquisition time ~ 17 h.

Hydra's unique multi-ion beam technology enables the precise and efficient analysis of buried defects in semiconductor packaged die and power devices

3D reconstruction of Caenorhabditis elegans L1 with a Helios Hydra CX DualBeam using O+ focused ion beam. Sample preparation: high pressure frozen and freeze substituted and HM20 embedded. Tomogram of a 30 × 30 × 15 µm (resolution ~10 x ×10 x ×15 nm). Acquisition time ~ 16 h. Courtesy Dr. Alex DeMarco, Monash University, Australia.
https://www.biorxiv.org/content/10.1101/457820v1.full.pdf

Applications

Process control using electron microscopy

Process control using electron microscopy

Modern industry demands high throughput with superior quality, a balance that is maintained through robust process control. SEM and TEM tools with dedicated automation software provide rapid, multi-scale information for process monitoring and improvement.

 

Quality control and failure analysis using electron microscopy

Quality control and failure analysis

Quality control and assurance are essential in modern industry. We offer a range of EM and spectroscopy tools for multi-scale and multi-modal analysis of defects, allowing you to make reliable and informed decisions for process control and improvement.

Fundamental Materials Research_R&amp;D_Thumb_274x180_144DPI

Fundamental Materials Research

Novel materials are investigated at increasingly smaller scales for maximum control of their physical and chemical properties. Electron microscopy provides researchers with key insight into a wide variety of material characteristics at the micro- to nano-scale.

 

Semiconductor failure analysis

Semiconductor Failure Analysis

Complex semiconductor device structures result in more places for defects to hide. Learn more about failure analysis solutions to isolate, analyze, and repair defects.

Techniques

Criotomografia

A tomografia crioeletrônica (crio-ET) fornece tanto informações estruturais sobre proteínas individuais como seus arranjos espaciais dentro da célula. Isso faz dela uma técnica verdadeiramente única e também explica por que o método tem um potencial imenso para a biologia celular. A tomografia crioeletrônica pode preencher a lacuna entre microscopia de luz e técnicas de resolução quase atômica, como a análise de partículas únicas.

Saiba mais ›

3D Materials Characterization

Development of materials often requires multi-scale 3D characterization. DualBeam instruments enable serial sectioning of large volumes and subsequent SEM imaging at nanometer scale, which can be processed into high-quality 3D reconstructions of the sample.

Learn more ›

(S)TEM Sample Preparation

DualBeam microscopes enable the preparation of high-quality, ultra-thin samples for (S)TEM analysis. Thanks to advanced automation, users with any experience level can obtain expert-level results for a wide range of materials.

Learn more ›

APT Sample Preparation

Atom probe tomography (APT) provides atomic-resolution 3D compositional analysis of materials. Focused ion beam (FIB) microscopy is an essential technique for high-quality, orientation, and site-specific sample preparation for APT characterization.

Learn more ›

Cross-sectioning

Cross sectioning provides extra insight by revealing sub-surface information. DualBeam instruments feature superior focused ion beam columns for high-quality cross sectioning. With automation, unattended high-throughput processing of samples is possible.

Learn more ›

In Situ experimentation

Direct, real-time observation of microstructural changes with electron microscopy is necessary to understand the underlying principles of dynamic processes such as recrystallization, grain growth, and phase transformation during heating, cooling, and wetting.

Learn more ›

Multi-scale analysis

Novel materials must be analyzed at ever higher resolution while retaining the larger context of the sample. Multi-scale analysis allows for the correlation of various imaging tools and modalities such as X-ray microCT, DualBeam, Laser PFIB, SEM and TEM.

Learn more ›

Remoção de camadas de dispositivo

Reduzir o tamanho do recurso, juntamente com um desenho e arquitetura avançados, resulta em uma análise de falha cada vez mais desafiadora para semicondutores. A remoção de camadas sem danos aos dispositivos é uma técnica crítica para a detecção de defeitos e falhas elétricas ocultos.

Saiba mais ›

Criotomografia

A tomografia crioeletrônica (crio-ET) fornece tanto informações estruturais sobre proteínas individuais como seus arranjos espaciais dentro da célula. Isso faz dela uma técnica verdadeiramente única e também explica por que o método tem um potencial imenso para a biologia celular. A tomografia crioeletrônica pode preencher a lacuna entre microscopia de luz e técnicas de resolução quase atômica, como a análise de partículas únicas.

Saiba mais ›

3D Materials Characterization

Development of materials often requires multi-scale 3D characterization. DualBeam instruments enable serial sectioning of large volumes and subsequent SEM imaging at nanometer scale, which can be processed into high-quality 3D reconstructions of the sample.

Learn more ›

(S)TEM Sample Preparation

DualBeam microscopes enable the preparation of high-quality, ultra-thin samples for (S)TEM analysis. Thanks to advanced automation, users with any experience level can obtain expert-level results for a wide range of materials.

Learn more ›

APT Sample Preparation

Atom probe tomography (APT) provides atomic-resolution 3D compositional analysis of materials. Focused ion beam (FIB) microscopy is an essential technique for high-quality, orientation, and site-specific sample preparation for APT characterization.

Learn more ›

Cross-sectioning

Cross sectioning provides extra insight by revealing sub-surface information. DualBeam instruments feature superior focused ion beam columns for high-quality cross sectioning. With automation, unattended high-throughput processing of samples is possible.

Learn more ›

In Situ experimentation

Direct, real-time observation of microstructural changes with electron microscopy is necessary to understand the underlying principles of dynamic processes such as recrystallization, grain growth, and phase transformation during heating, cooling, and wetting.

Learn more ›

Multi-scale analysis

Novel materials must be analyzed at ever higher resolution while retaining the larger context of the sample. Multi-scale analysis allows for the correlation of various imaging tools and modalities such as X-ray microCT, DualBeam, Laser PFIB, SEM and TEM.

Learn more ›

Remoção de camadas de dispositivo

Reduzir o tamanho do recurso, juntamente com um desenho e arquitetura avançados, resulta em uma análise de falha cada vez mais desafiadora para semicondutores. A remoção de camadas sem danos aos dispositivos é uma técnica crítica para a detecção de defeitos e falhas elétricas ocultos.

Saiba mais ›

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