FIB SEM | FIB SEM Laser | Thermo Fisher Scientific

Helios 5 Laser PFIB System

The Thermo Scientific Helios 5 Laser PFIB System combines the best-in-class monochromated Elstar Scanning Electron Microscopy (SEM) Column with a plasma focused ion beam (PFIB) and a femtosecond laser to produce a high-resolution imaging and analysis tool with in-situ ablation capability, offering unprecedented material removal rates for fast millimeter-scale characterization at nanometer resolution.

Statistically relevant subsurface and 3D characterization

The femtosecond laser can cut many materials at rates orders of magnitude faster than a typical gallium FIB; a large (100s of micrometers) cross-section can be created within 5 minutes. As the laser has a different removal mechanism (ablation vs the ion sputtering of FIB), it can easily process challenging materials, such as non-conductive or ion-beam sensitive samples.

High-quality large volume analysis

The extremely short duration of the femtosecond laser pulses introduces almost no artifacts such as heat impact, microcracking, melting, or those typical of traditional mechanical polishing. In most cases, the laser-milled surfaces are clean enough for direct SEM imaging and even for surface-sensitive techniques such as electron backscatter diffraction (EBSD) mapping.

Built on the proven Helios 5 PFIB platform, this instrument incorporates a suite of state-of-the-art technologies to provide high-performance, high-resolution transmission electron microscopy (TEM) and atom probe tomography (APT) sample preparation and extremely high-resolution SEM imaging with precise materials contrast.

Key Features

Fast material removal

Millimeter-scale cross sections with up to 15,000x faster material removal than a typical gallium focused ion beam.

Statistically relevant subsurface and 3D data analysis

Acquire data for much larger volumes within a shorter amount of time.

Accurate and repeatable cut placement

The same coincident point for all 3 beams (SEM/PFIB/laser) enables accurate and repeatable cut placement and 3D characterization.

Fast characterization of deep subsurface features

Extraction of subsurface TEM lamella or chunks for 3D analysis.

High throughput processing of challenging materials

Includes non-conductive or ion-beam-sensitive samples.

Fast and easy characterization of air-sensitive samples

No need to transfer samples between different instruments for imaging and cross-sectioning.

Shares all capabilities of the Helios 5 PFIB platform

High-quality gallium-free TEM and APT sample preparation and high-resolution imaging capabilities.

Specifications

产品表格规范样式表

Femtosecond-laser specifications
Laser integration	Fully integrated in the chamber with the same coincident point for all 3 beams (SEM/PFIB/laser), enabling accurate and repeatable cut placement and 3D characterization.
Laser Output
First Harmonic	Wavelength	1030 nm (IR)
	Pulse duration	<280 fs
Second Harmonic	Wavelength	515 nm (green)
	Pulse duration	<300 fs
Optics
Coincident point	Working distance= 4 mm (Same as SEM/FIB)
Objective lens	Variable (motorized)
Polarization	Horizontal/vertical
Repetition rate	1 kHz – 1 MHz
Position accuracy	<250 nm
Protective shutter	Automated SEM/PFIB protective shutter
Software	Laser control software Laser 3D serial sectioning workflow Laser 3D serial sectioning workflow with EBSD Laser scripting with optional Thermo Scientific AutoScript 4 Software
Safety	Interlocked laser enclosure (Class 1 laser safety)

Style Sheet for Komodo Tabs

Resources

Webinar
Images

On demand webinar: Discover the all new Helios 5 Laser PFIB

Register for our recorded webinar and learn how the combination of fs-Laser and PFIB provides mm-scale subsurface and 3D analysis at nm resolution and enables new workflows such as fast characterization of air sensitive samples and multi-scale correlative microscopy with deep subsurface sample extraction.

Latest application developments of multiple ion species plasma FIB technology

Register for our live webinar and learn how leading research labs are using our new Thermo Scientific Helios 5 Laser PFIB and Thermo Scientific Helios 5 Hydra DualBeam to advance their materials characterization.

Solder bump 3D reconstruction created with plasma FIB laser SEM tool

3D reconstruction of a solder bump acquired with the Helios 5 Laser PFIB System.

GPU stack cross section created with plasma FIB laser SEM tool.

Large area cross-section of a GPU stack created with the Helios 5 Laser PFIB System. A fast polishing step with the plasma FIB allows you to resolve fine details at the nanometer scale.

Nylon sample cross section created with laser on a plasma FIB laser SEM tool.

Cross-section of a nylon sample. This material is challenging for FIB milling as it is non-conductive and beam sensitive, but it can easily be processed with the femtosecond laser.

Carbon fiber reinforced composite 3D reconstruction created with plasma FIB laser SEM tool.

Large-volume 3D reconstruction of a carbon-fiber-reinforced epoxy composite. The data was acquired using the Helios 5 Laser PFIB System, then processed and visualized with Avizo Software.

Steel sample cross section produced with laser on a plasma FIB laser SEM tool.

Large area (0.6 mm) cross-section of an additive manufacturing steel, milled by the femtosecond laser in less than 5 minutes.

Nickel superalloy sample 3D reconstruction, data obtained with plasma FIB laser SEM tool.

Large volume 3D EBSD reconstruction of a nickel superalloy sample. The data was acquired with the Helios 5 Laser PFIB System.

Glass fiber cross section produced with laser on a plasma FIB laser SEM tool.

Cross-sections of glass fibers. The femtosecond laser offers improved processing performance for challenging (non-conductive, thermally sensitive, shock-sensitive) materials such as this.

Solid state battery cross section produced with a plasma FIB laser SEM tool.

Large-area cross-section of a packaged solid-state battery. The Helios 5 Laser PFIB System enables fast characterization of air-sensitive materials by combining millimeter-scale cross-sectioning with high-resolution SEM imaging in the same vacuum chamber, eliminating the need for sample transfer.

Webinar