TEM sample preparation

TEM sample preparation is considered to be one of the most critical tasks in materials science research. However, it is also one of the most challenging and time-consuming. The latest technological innovations of DualBeam technology, along with our comprehensive software solutions and application expertise, enable fast and easy preparation of site-specific, high-quality S/TEM (scanning/transmission electron microscopy) samples for a wide range of materials. Thermo Scientific AutoTEM Software adds the capability for fully automated, unattended in situ TEM sample preparation, significantly increasing throughput and bringing you expert-level results regardless of your experience.

Structural analysis

When combined with Thermo Scientific Auto Slice & View Software, DualBeam instruments provide 3D insight into sample structure by selectively removing (milling) the material for subsurface characterization. Digital reconstruction generates multi-modal 3D datasets that can consist of a variety of signals, including backscattered electron (BSE) imaging for maximum materials contrast, energy dispersive spectroscopy (EDS) for compositional information, and electron backscatter diffraction (EBSD) for microstructural and crystallographic information.

The SEM capability of DualBeam instruments offers nanoscale details across a wide range of working conditions, from structural information obtained at 30 keV in STEM mode to charge-free, detailed surface information at lower energies. With unique in-lens detectors, DualBeam systems are designed for simultaneous acquisition of angular/energy-selective secondary-electron and BSE data. Fast, accurate, and reproducible results are provided by our unique SEM column design, which features fully automated lens alignments.

Nanoprototyping

The nanopatterning capabilities of DualBeam systems can substantially reduce research and development time. Rapid prototyping with the FIB enables functionality testing before the final device layout is established for batch fabrication. Beam-induced deposition of different materials can be combined with FIB milling without the need for additional aligning lithography steps; patterns can be directly added to deposited structures or existing patterns can be modified. The final patterned substrates are immediately available for further processing or characterization.